CMP proposes a lot of technologies in CMOS, BiCMOS, SiGe BiCMOS, P-HEMT GaAs for ICs manufacturing in prototyping and low volume.

CMP provides several types of MEMS technologies for prototyping : Integrated bulk micromachining technologies and specific surface micromachining technologies.

CMP offers a complete assembly service based on a wide range of ceramic and plastic packages for prototypes and low volume production.

CMP distributes the design rules for each technology and the standard cell libraries for each specific software tool (design kits).

The use of CMP services implies the acceptation of these Terms and Conditions.