Chair: Bernard COURTOIS, CMP, Grenoble, France - Vice General Chair: Pascal NOUET, LIRMM, Montpellier, France
Co-Chair: Jean Michel KARAM, MEMSCAP, Bernin, France
 Cannes Côte d'Azur, France 1-4 April 2014 |
SYMPOSIUM on Design, Test, Integration & Packaging of MEMS/MOEMS |
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Aim
presentations | Reviewer access | Hotel / Venue & Access | Contacts | Social event | Registration | Technical program | Conferences: | CAD, Design and Test Conference | Microfabrication, Integration and Packaging Conference | Panel | Invited Speakers Special Sessions Past events |
The Organizing Committee thanks the participants for their contributions to the programme and ambiance of DTIP 2014!
The Symposium is sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society and by CMP.