Chair: Bernard COURTOIS, CMP, Grenoble, France
Co-Chair: Jean Michel KARAM, MEMSCAP, Bernin, France
![]() Barcelona, Spain 16-18 April 2013 |
SYMPOSIUM on Design, Test, Integration & Packaging of MEMS/MOEMS |
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Paper presentation | Reviewer access | Hotel / Venue & Access | Contacts | Social event | Registration | Technical program | Conferences: | CAD, Design and Test Conference | Microfabrication, Integration and Packaging Conference | Invited Speakers Special Sessions Past events |
The Symposium is sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society and by CMP.
Bernard COURTOIS & Jean-Michel KARAM