dtip
Barcelona, Spain
16-18 April 2013
SYMPOSIUM on

Design, Test, Integration
& Packaging of MEMS/MOEMS
collage

mipMicrofabrication, Integration and Packaging Conference

Chair: Toshihiro ITOH , AIST, Japan
Co-Chair: Benoit CHARLOT, IES, Montpellier, France

The Microfabrication, Integration and Packaging Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks.

Programme Committee (to include):
  • Adrian IONESCU, EPFL, Lausanne, Switzerland
  • Alain BOSSEBOEUF, IEF, Paris-Orsay, France
  • Andrew TAY, National Univ. of Singapore
  • Christian A. ZORMAN, Case Western Reserve Univ., Cleveland, USA
  • Erik JUNG, Fraunhofer IZM, Germany
  • Giancarlo BARTOLUCCI, Roma "Tor Vergata" University, Italy
  • Gou-Jen WANG, National ChungHsing Univ., Taiwan
  • Henri CAMON, LAAS, Toulouse, France
  • Hsiharng YANG, National Chung Hsing Univ., Taiwan
  • Juerg DUAL, ETH Zentrum, Zürich, Switzerland
  • Masayoshi ESASHI, Tohoku Univ., Japan
  • Philippe RENAUD, EPFL, Lausanne, Switzerland
  • Susumu KAMINAGA, Sumitomo Precision Products Co., Japan
  • Xuechuan SHAN, SIMTech, Singapore
  • Yuelin WANG, SIMIT, Shanghai, China
  • Yves-Alain PETER, EPM, Montréal, Canada
  • Zhenfeng WANG, SIMTech, Singapore
  • Dong F. WANG, Ibaraki Univ., Japan
  • Alexandra GARRAUD, Univ. Florida, USA
  • Emanuela PROIETTI, IMM Roma, Italy
  • Victor M. BRIGHT, Univ. of Colorado at Boulder, USA
  • Eng Hock (Francis) TAY, National Univ. of Singapore
  • Geok Ing NG, Nanyang Technological Univ., Singapore
  • Jyh-Cheng (Jason) YU, Nat'l Kaohsiung 1st U. of Sc.& Tech., Taiwan
  • Xuming[AP] ZHANG The Hong Kong Polytechnic Univ., China
  • Philippe BASSET, ESIEE, Noisy-le-Grand, France
  • Matthias WORGULL, KIT, Karlsruhe, Germany
  • Virginia CHU, INESC MN, Portugal
  • Robert PUERS, KU Leuven, Belgium

Topics

The topics for this Conference include (preliminary):
Integrated processes (micromachining, micromolding, ...)
Process integration between MEMS and electronics
Microlithography issues unique to MEMS/MOEMS
Manufacturing
Materials
Assembly technologies
Packaging for harsh environments
MOEMS packaging
RF and microwave packaging
Test structures
Devices and components (sensors, actuators, ...)
Dimensional measurements
Physical measurements
Failure analysis
Reliability
Characterization
Process monitoring
Non destructive evaluation