dtip
Barcelona, Spain
16-18 April 2013
SYMPOSIUM on

Design, Test, Integration
& Packaging of MEMS/MOEMS
collage

cadtCAD, Design and Test Conference

Chair: Bernard COURTOIS, CMP Grenoble, France
Co-Chair: Arturo AYON, Univ. of Texas at San Antonio, USA

The CAD, Design and Test Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks.

Programme Committee (to include):
  • Pascal NOUET, LIRMM, Montpellier, France
  • Anis Nurashikin NORDIN, Int' Islamic Univ, Kuala Lumpur, Malaysia
  • Francis PRESSECQ, CNES, Toulouse, France
  • Gerold SCHROEPFER, Coventor, France
  • Libor RUFER, TIMA Lab., Grenoble, France
  • Mahnaz SHAMSHIRSAZ, Amirkabir Univ. of Tech., Tehran, Iran
  • Marta RENCZ, BUTE, Budapest, Hungary
  • Rainer LAUR, Univ. of Bremen, Germany
  • Robert RUDD, Lawrence Livermore National Lab. Livermore, USA
  • Souhil MEGHERBI, Univ. Paris Sud, France
  • Thomas ZAHNER, OSRAM Opto Semiconductors, Germany
  • Aurelio SOMA, Politecnico di Torino, Italy
  • Romolo MARCELLI, CNR-IMM Roma, Italy
  • Gerhard WACHUTKA, Munich Univ. of Technology, Germany
  • Bart ROMANOWICZ, Nano Science & Technology Institute, Cambridge, USA
  • Gaelle LISSORGUES, ESIEE, Noisy-le-Grand, France
  • Franck CHOLLET, Femto-ST, France
  • Ai Qun LIU, Nanyang Techn. U., Singapore
  • Andrew RICHARDSON, Lancaster University, UK
  • Igor BALK, TDC LLC, USA
  • Jian ZHU, Nanjing Electronic Devices Institute, China
  • Yung C. LIANG, National Univ. of Singapore
  • Shawn BLANTON, Carnegie Mellon Univ., Pittsburgh, USA
  • Narayan R. ALURU, Univ. of Illinois Champaign, Urbana, USA
  • Ash PARAMESWARAN, SFU, Canada
  • Ray ROOP, Freescale Semiconductor, Inc., USA
  • Kazuhiro HANE, Sendai University, Japan
  • Hisham HADDARA, Si-Ware Systems, Cairo, Egypt
  • Vladimir SOBOLEV, South Dakota School of Mines and Technology (SDSMT) USA
  • Tamal MUKHERJEE, Carnegie Mellon Univ., Pittsburgh, USA
  • Jan MEHNER, TU Chemnitz, Germany
  • Peter SCHNEIDER, Fraunhofer IIS/EAS, Dresden, Germany

Topics

The topics for this Conference include (preliminary):
Technology CAD in general
Modeling and simulation of fabrication processes
Devices and components (sensors, actuators, ...)
MEMS/MOEMS libraries and IP
Signal processing
Integrated CAD tools
Numerical simulation
Yield estimation
Failure mechanisms
Fault modeling
Fault simulation and test pattern generation
Mechanical simulation
Thermal evaluation
Interoperability of CAD/CAE tools
Multiphysics simulation
Structured design methodologies
Languages for interchange data among designs and tools
Model order reduction