Chair: Bernard COURTOIS, CMP, Grenoble, France
Co-Chair: Jean Michel KARAM, MEMSCAP, Bernin, France
 Aix-en-Provence, France 11-13 May 2011 |
SYMPOSIUM on
Design, Test, Integration & Packaging of MEMS/MOEMS |
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Aim
Presentations | Hotel / Venue & Access | Contacts | Social event | Poster Information | Registration | Panels | Technical program | Conferences: | CAD, Design and Test Conference | Microfabrication, Integration and Packaging Conference | Invited Speakers Special Sessions Past events |
The Organizing Committee thanks the participants from 17 countries for their contributions to the programme and ambiance of DTIP 2011 !
The Symposium is sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society and by CMP.
Bernard COURTOIS & Jean-Michel KARAM