Chair: Bernard COURTOIS, CMP, Grenoble, France
Co-Chair: Jean Michel KARAM, MEMSCAP, Bernin, France
 Rome, Italy 1-3 April 2009 |
SYMPOSIUM on
Design, Test, Integration & Packaging of MEMS/MOEMS |
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Aim
Presentations | Venue & Access | Contacts | Social event | Exhibition & Poster Information | Registration | Hotel accommodation | Technical program | Conferences | CAD, Design and Test Conference | Microfabrication, Integration and Packaging Conference | Invited Speakers Special Sessions Past events |
The Organizing Committee thanks the participants from 23 countries for their contributions to the programme and ambiance of DTIP 2009 !