Chair: Bernard COURTOIS, CMP, Grenoble, France
Co-Chair: Jean Michel KARAM, MEMSCAP, Bernin, France
 French Riviera 09-11 April 2008 |
SYMPOSIUM on
Design, Test, Integration & Packaging of MEMS/MOEMS |
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Aim
Presentations | Venue & Access | Contacts | Tutorials | Social event | Exhibition & Poster Information | Registration | Hotel accommodation | Technical program | Conferences | CAD, Design and Test Conference | Microfabrication, Integration and Packaging Conference | Invited Speakers Past events |
The Organizing Committee thanks the participants from 25 countries for their contributions to the programme and ambiance of DTIP 2008!
Bernard Courtois, CMP, Grenoble, France
Jean Michel Karam, MEMSCAP, Bernin, France