25-27 April 2007 - Stresa, Lago Maggiore, Italy.
Sponsored by

IEEE Components, Packaging and Manufacturing Technology Society

In cooperation with

Chair: Bernard COURTOIS, CMP-TIMA, Grenoble, France
Co-Chair: J-M. KARAM, MEMSCAP, Bernin, France

Conferences Invitation to participate
CAD, Design and Test

Duke Univ., Durham, USA
Co-Chair: R. LAUR,
Univ. of Bremen, Germany

Microfabrication, Integration and Packaging

Chair: E. JUNG,
IZM, Berlin, Germany
Co-Chair: V. KEMPE,
SensorDynamics AG, Austria
This Symposium will be a follow-up to the very successful issues held in 1999 and 2000 in Paris, in 2001, 2002 and 2003 in Mandelieu-La Napoule and in 2004 and 2005 in Montreux Switzerland and in 2006 in Stresa, Italy. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems.
We look forward to welcoming you to Stresa and encourage you to participate by submitting an abstract for one of the two Conferences.


Submission of abstracts: 10 November 2006
Notification of acceptance: 22 January 2007
CAD, Design and Test Microfabrication, Integration
and Packaging
Chair: K. CHAKRABARTY, Duke Univ., Durham, USA
Co-Chair: R. LAUR, Univ. of Bremen, Germany

Programme Committee
(to include)

Z. CUI, RAL, Didcot, UK
F. PRESSECQ, CNES, Toulouse, France
M. RENCZ, BUTE, Budapest, Hungary
P. SCHWARZ, IIS Schaltungen, Dresden, Germany
A. RICHARDSON, Lancaster Univ., UK
Y-C. LIANG, National Univ. of Singapore, Singapore
R. RUDD, Lawrence Livermore National Lab., USA
S. BLANTON, Carnegie Mellon Univ., Pittsburgh, USA
T. VEIJOLA, Helsinki Univ. of Technology, Finland
M.A. POLOSKY, Sandia National Labs, Albuquerque, USA
J. ZHU, Nanjing Electronic Devices Institute, China
I. BALK, The Ramzay Technologies Inc, Brighton, USA
G. WACHUTKA, Munich Univ. of Technology, Germany

The CAD, Design and Test Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS.
The participants will also have the opportunity to interact with the other Conference by the means of plenary talks.

The topics for this Conference include (preliminary):
• Technology CAD in general
• Modeling and simulation of fabrication processes
• Devices and components (sensors, actuators, ...)
• MEMS/MOEMS libraries and IP
• Signal processing
• Integrated CAD tools
• Numerical simulation
• Yield estimation
• Failure mechanisms
• Fault modeling
• Fault simulation and test pattern generation
• Mechanical simulation
• Thermal evaluation
• Interoperability of CAD/CAE tools
• Multiphysics simulation
• Structured design methodologies
• Languages for interchange data among designs and tools
• Model order reduction
Chair: E. JUNG, IZM, Berlin, Germany
Co-Chair: V. KEMPE, SensorDynamics AG, Austria

Programme Committee
(to include)

C. KHAN MALEK, Lab. FEMTO-ST/LPMO, Besançon, France
A. IONESCU, EPFL, Lausanne, Switzerland
D. ALLEN, Cranfield Univ., Bedford, UK
S. BASROUR, TIMA Labs, Grenoble, France
K. BAERT, IMEC, Belgium
H. YANG, National Chung Hsing Univ., Taiwan
A. TAY, National Univ. of Singapore, Singapore
W. REINERT, Fhf Inst. for Silicon Technology, Itzehoe, Germany
M. HECKELE, FZK, Karlsruhe, Germany
V. BRIGHT, Univ. of Colorado, Boulder, USA
H. CAMON, LAAS, Toulouse, France
J. DUAL, ETH Zentrum, Zürich, Switzerland
B. MICHEL, IZM, Berlin, Germany
Y-A. PETER, EPM, Montréal, Canada
Ph. RENAUD, EPFL, Lausanne, Switzerland
Y. WANG, SIMIT, Shanghai, China
P. NICOLE, Thales Group, France
R. MAEDA, AIST, Tsukuba, Japan

The Microfabrication, Integration and Packaging Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS.
The participants will also have the opportunity to interact with the other Conference by the means of plenary talks.

The topics for this Conference include (preliminary):
• Integrated processes (micromachining, micromolding, ...)
• Process integration between MEMS and electronics
• Microlithography issues unique to MEMS/MOEMS
• Manufacturing
• Materials
• Assembly technologies
• Packaging for harsh environments
• MOEMS packaging
• RF and microwave packaging
• Test structures
• Devices & components (sensors, actuators, ...)
• Dimensional measurements
• Physical measurements
• Failure analysis
• Reliability
• Characterization
• Process monitoring
• Non destructive evaluation
  Plenary invited talks
Plenary invited talks given by prominent speakers will include:
In the framework of the SPOT-NOSED European project, nanoscale sensing elements bearing olfactory receptors and grafted onto functionalized gold substrates are used as odorant detectors to develop a new concept of nanobioelectronic nose, through sensitive impedancemetric measurement of single receptor conformational change upon odorant ligand binding, with a better specificity and lower detection thresholds than traditional physical sensors.
University of Washington
Massively parallel self-assembling systems present a promising alternative to conventional manufacturing. Instead of pick-and-place, positioning of parts is accomplished by minimization of potential or interfacial energies. This approach scales favorably with decreasing size and increasing number of parts, and can lead to higher efficiency and reduced cost in manufacturing and packaging.
  Special Session
Griet van CAENEGEM, European Commission, DG Information Society & Media: Micro and Nanosystems.
The area which started with MEMS devices has grown into an area of Microsystems and Micro Nano Technology for a wide set of applications. Today researchers from various disciplines are working together to achieve the objectives of research in the MST field. Technologies are converging while the MST field is expanding to the field of ‘Smart Integrated Systems’. In the future the 7th Framework and the further coordination of national or regional initiatives will help to realise the research agenda for this strategic field for Europe. The presentation will present some ongoing initiatives, some visions and an outlook for the future.
Tel.: +33 476 574 615
Fax: +33 476 473 814
Jean-Michel KARAM
Tel.: +33 4 76 92 85 00
Fax: +33 4 76 92 85 10
An exhibition will be organized in the framework of the Symposium. CAD software, products, equipments, instruments, foundries offerings, ...etc, may be exhibited. Exhibitors who will register early enough will be given the opportunity to give a product presentation during the vendor session that will be placed in the Symposium programme.
If you plan to exhibit, please contact the Symposium Chair.
  Specific Events Sponsoring
If you wish to sponsor an event like a reception, a lunch, or any specific event during the Symposium, please contact the Symposium Chair.
  Advertising in the programme booklet
The programme booklet will be widely distributed to announce the Symposium. If you wish to advertise in the programme booklet, please contact the Symposium Chair.
The Symposium will take place in Stresa in Italy. This international tourist resort situated in a central but also panoramic and pictoresque position along the lakeside roadway, stands just in front of the Borromee isles. Since the second half of nineteenth century up to the first decades of the twentieth, when the first English touritsts arrived, Stresa, whose hotels and villas built in Liberty style make it unique, assumed its peculiar, elegant look.
  Paper Review
To ensure a high-quality Symposium, all abstracts will be reviewed by the Programme Committee members under the leadership of the Conference Chairs, and the Proceedings papers will be reviewed by the Conference Chairs for technical merit and content.
  Oral or Poster Presentation
Submitted papers may be selected for oral or poster presentation. All oral and poster presentations will be included in the Symposium Proceedings.
  Submission of Abstracts
Your abstract must include the following:
• AUTHOR LISTING (principal author first)
First (given) name, Last (family) name, and affiliations, mailing address, telephone, fax and e-mail address.
Indicate your preference for "Oral Presentation" or "Poster Presentation".
Placement is subject to chair's discretion.
Your abstract must include preferably 1500 words.
List a maximum of five key words.
• BRIEF BIOGRAPHY (of principal author)
Approximately 50 words.

Submission will be electronically only.
Detailed instructions will be posted in due time on the Symposium web site.
Questions may be directed in the meantime by e-mail.
  Conditions of Acceptance
Authors are expected to secure registration fees and travel and accommodation funding, through their sponsoring organizations, before submitting abstracts. Abstracts should contain enough detail to clearly convey the approach and the results of the research. Government and company clearance to present and publish should be final at the time of submittal.
Commercial papers with no research, presenting products, cannot be submitted to the Symposium. Such papers can be presented in the framework of the exhibition (see corresponding section).
  Special Issues of Journals and Magazines
It is a tradition that Special Issues of Journals and Magazines are published after the Symposium. These Special Issues collect revised versions of papers presented during the Symposium.
DTIP 2007 Special Issues will be organized in the Journal of Microsystem Technologies and in the Journal of Analog Integrated Circuits and Signal Processing.
Proceedings of the Symposium will be available at the meeting.