Technical Programme

MONDAY MAY 30th, 2005 p.m. and TUESDAY MAY 31st, 2005.

Workshop on DESIGN FOR MICRO & NANO MANUFACTURE

Background and Objectives.
Organised by the EC-funded Network of Excellence "Design for Micro & Nano Manufacture", PATENT-DfMM. The network aims to establish a collaborative team to provide European industry with support in the field of "Design for Micro and Nano Manufacture (DfMM)" to ensure that problems affecting the manufacturing and reliability of products based on micro nano technologies (MNT) can be addressed before prototyping and production. PATENT-DfMM (www.patent-dfmm.org) is an initiative that builds on industrial needs, which have been defined by key commercial players and studied by the NEXUS "Design Modelling Simulation" workshops. PATENT-DfMM co-operates worldwide to coordinate research and services in DfMM.

This workshop will present European research activities in the areas of MEMS Test and Packaging, discuss objectives, and aims at getting feedback on industry needs in the Design for Micro and Nano Manufacture. It also includes tutorials on Failure Analysis and Thermal Characterisation.
Monday 30 May
14:00 - 15:30 Latest Advances in MEMS Testing
Organised by P. Nouet, LIRMM, France
This session will address a selection of Design for Test (DfT) solutions recently proposed to reduce the cost of MEMS testing.
15:50 - 17:20 Tutorial "Techniques for Failure Analysis of MEMS and MEMS Packages"
I. De Wolf, IMEC, Belgium
The focus of this tutorial is on failure analysis (FA) of MEMS and MEMS packaging. Techniques commonly used for FA of IC's and IC-packages that can also be used for MEMS, are discussed. But also new techniques specific to MEMS FA will be introduced and their application field, advantages and disadvantages will be discussed.
Tuesday 31 May
09:00 - 10:30 Tutorial "Thermal Characterisation of MEMS Structures and Packages"
M. Rencz, BUTE/MicReD, Hungary
This tutorial gives an introduction to the thermal characterisation of MEMS elements and packages. It introduces the theory of the thermal transient characterisation method and presents how to use it for structure integrity checking and for model generation.
10:50 - 12:20 European Research Programmes in MEMS Packaging / Package Engineering
Organised by A. Brown, QinetiQ, UK
European research programmes in MEMS packaging will be presented. These include an overview on the "package engineering" projects within the PATENT-DfMM project.
14:00 - 17:20 NEXUS MWG-DMS and NoE PATENT-DfMM Workshop "Design Modelling Simulation of MEMS"
Organised by P. Salomon, 4M2C PATRIC SALOMON GmbH, Germany
This workshop is co-organised by the NEXUS Methodology Working Group "Design Modelling Simulation" (MWG-DMS), formerly USC-CAD, and the NoE PATENT-DfMM. Its objective is to share latest developments and ideas for "Design for Manufacture" methodologies and their potential implementation into algorithms and design tools. Presentations will be from design, modelling and simulation experts and commercial EDA providers.

Attendance and Registration fee.
Attendance to the workshop will be open, but the number of participants will be limited. The registration fee is €150 (including the coffee breaks on 30 and 31 May, the lunch on 31 May). It is necessary to register using the DTIP Registration form. The detailed programme of the workshop will be updated at PATENT-DfMM. For additional information or if you are interested in presenting within this workshop, please contact Patric Salomon.

TUESDAY MAY 31st, 2005.

Workshop on DESIGN AND MODELLING METHODS FOR RF MEMS

Background.
Due to the multidisciplinary nature of the technologies involved in future communication systems and the objective to build smart systems, it is important to bring together a critical mass of expertise of the most capable research groups in Europe. In AMICOM, which is a Network of Excellence funded by the European Commission, 25 research organizations of all over Europe are gathered which are working in the field of RF MEMS. The aim of AMICOM is to assemble and integrate the isolated competences that exist around Europe in this field.

Objectives.
The workshop will focus on the different aspects of RF MEMS design and modelling, including electromagnetical, mechanical simulations as well as model extraction. A broad range of modelling expertise will be represented by the workshop participants within and outside AMICOM. The competences integrated in AMICOM will be presented. The workshop is also an opportunity for individuals and organizations not currently in AMICOM to contribute to the integration of RF MEMS activity in Europe. The workshop attendees will be exposed to a abroad overview of research activities in the design and modelling of RF MEMS. The program will include provisions for discussions and exchange of information.

Organization and scientific committee.
Larissa Vietzorreck, TU München, Germany.
David Elata, Technion, Israel.
Paolo Mezzanotte, University of Perugia, Italy.

Information regarding the workshop can be found at AMICOM.

Format.
The workshop will be a one-day workshop on Tuesday May 31, 2005.

Attendance and registration fee.
Attendance to the workshop will be open, but the number of participants will be limited. The registration fee is €100 (including the coffee breaks and the lunch on 31 May). It is necessary to register using the DTIP Registration form. The detailed programme of the workshop will be updated at AMICOM. For additional information please contact Larissa Vietzorreck, David Elata.

Wesnesday June 1st


7.30-8:30 Registration

8:30-8:40 Opening
B. Courtois,
TIMA Labs, Grenoble, France
E. Jung, IZM, Berlin, Germany
G. Wachutka, TU München, Germany

8:40-9.20 Invited talk 1: MICRO/NANOMECHANICAL INSTRUMENTATIONS FOR NANOENGINEERING
Organizer: : T. Ono, Tohoku U., Japan
Chair: K. Markus, Zeus Strategies, LLC, Durham, USA

9.20-10.00 Invited talk 2: MicroFluidic CELL MANIPULATION AND MODIFICATION DEVICES
Organizer: Ph. Renaud, EPFL, Lausanne, Switzerland
Chair: M. Esashi, Tohoku U., Japan

10.00-10.50 Vendors session
Chair: B. Courtois, TIMA Labs, Grenoble, France

10.50-11.10 Coffee Break

11.10-11.50 Invited talk 3: MICROSYSTEMS FOR LIGHT PROCESSING
Organizer: H. Schenk, FhZ Inst. Photonic Microsystems, Dresden, Germany
Chair: J-M. Karam, MEMSCAP, Bernin, France

11.50-13.10 Panel on FOR MICRO & NANO MANUFACTURE AND PACKAGING
Moderator: P. Salomon, 4M2C PATRIC SALOMON, Berlin, Germany
A. Richardson, U. Lancaster, UK
K. Persson, IMEGO, Sweden
F. Rudolf, Colibrys S.A., Switzerland
J. Deacon, PERA, UK

13.15-15:00 Lunch
15:00-17:00
Session 1: MICRODEVICE DESIGN AND TEST
Chair: F. Maloberti, Texas A&M Univ., College Station, USA
Session 2: FABRICATION OF DEVICES AND COMPONENTS
Chair: P. French, TU Delft, The Netherlands
SILICON BASED MICRO COMBUSTOR WITH A HAIRPIN SHAPE FUEL/GAS RECIRCULATION CHANNEL
Z-F. Wang, X-C. Shan, Y-F. Jin, C-K. Wong, Singapore Institute of Manufacturing Technology, Singapore
M. Wu, J-S. Hua, Institute of High Performance Computing, Singapore
FABRICATION PROCESS OF A MICRO-INDUCTOR UTILISING A THIN FILM CORE
D. Flynn, M. Desmulliez, T. Toon, Heriot-Watt U., Edinburg, UK
A DIELECTROPHORETIC CHIP PACKAGED AT WAFER LEVEL
C. Iliescu, G. Xu, V. Samper, IBN, Singapore
E-H., F. Tay, L. Yu, National U. of Singapore, Singapore
MEMS-BASED FORMALDEHYDE GAS SENSOR INTEGRATED WITH A MICRO-HOTPLATE
C-Y. Lee, Da-Yeh U., Taiwan
C-M. Chiang, National Cheng-Kung U., Taiwan
P-Ch. Chou, Shu-Te U. of Science and Technology, Taiwan
L-M. Fu, National Pingtung U. of Science and Technology, Taiwan
C-H. Lin, National Sun Yat-sen U., Taiwan
A MICROMACHINED FLOW SENSOR FOR MONITORING AND EVALUATION OF URINARY DYSFUNCTION
M. Decarli, V. Guarnieri, A. Faes, B. Margesin, N. Viarani, N. Massari, M. Gottardi, A. Simoni, M. Zen,
M. Paranjape, Georgetown U., Washington, USA
TRIPLEX-PUMPING CD-LIKE MICROFLUDIC PLATFORM WITH PARABOLIC MICROCHANNELS
G-J. Wang, J-H. Chang, H. Yang, National Chung-Hisng U., Taiwan
SILICON DUAL-AXIS MICRO-MACHINED VIBRATING GYROSCOPE
S. Yan, Y. Bo, W. Shourong, Z. Jian, Southeast U., Nanjing, China
THE FABRICATION OF THE SILICON-BASED TWO-DIMENSIONAL PHOTONIC CRYSTALS
J. Zhu, B. Zhou, Southeast U., Nanjing China
Y. Zhang, J. Gao, S. Jia, Nanjing Electronic Devices Institute, Nanjing, China
RF BLADE NANO-ELECTROMECHANICAL RESONATOR WITH SELF-ALIGNED PROCESS FOR DEFINITION OF LATERAL ELECTROSTATIC TRANSDUCERS
V. Agache, H. Fujita, CIRMM/IIS The U. of Tokyo, Japan
B. Legrand, D. Collard, L. Buchaillot, IEMN, Villeneuve d'Ascq, France
NEW FABRICATION METHOD OF CONVEX MICROLENS ARRAY FOR INTEGRATED FLUORESCENCE MICROFLUIDIC DETECTION SYSTEMS
H. Yang, J-W. Huang, National Chung Hsing U., Taiwan
R-F. Shyu, National Huwei U. of Science and Technology, Taiwan
RF-MEMS TUNABLE NETWORKS FOR VCO APPLICATIONS
R. Gaddi, A. Gnudi, ARCES/U. of Bologna, Italy
B. Margesin, F. Giacomozzi, ITC-IRST, Povo, Italy
THREE-DIMENSIONAL THIN FILM MICROBATTERIES FOR AUTONOMOUS MEMS
M. Nathan, D. Golodnitsky, V. Yufit, E. Strauss, T. Ripenbein, I. Shechtman, S. Menkin, E. Peled, Tel Aviv U., Israel
17:00-17:30 Coffee Break
17:30-18:40
CAD, Design and Test Introduction Posters
Chair: M. Rencz, BUTE, Budapest, Hungary
Microfabrication, Integration and Packaging Introduction Posters
Chair: P. Nicole, Thales Group, France
17:30
BI-LAYERED MODELING OF MICRO-CANTILEVER UNDER HEAT-TREATMENT PROCESSES
C-Y. Lee, Da-Yeh U., Changhua, Taiwan
C-H. Tsai, L-W. Chen, Y-Ch. Chen, L-M. Fu, National Pingtung U. of Science and Technology, Taiwan
17:30
TWO-DIMENSIONAL MONOMODE OPTICAL FIBRE ARRAY MANUFACTURE USING MICROENGINEERING TECHNIQUES
D. Weiland, M. Luetzelschwab, M.P.Y Desmulliez, Heriot-Watt U., Edinburg, UK
17:35
ARTIFICIAL INTELLIGENT MODELS OF AN ELECTROMAGNETIC-ACTUATED MICROACTUATOR: AN APPLICATION OF NEURAL NETWORKS IN MEMS
R. Setia, J. Bintoro, A. Papania, G. May, P. Hesketh, Georgia Institute of Technology, Atlanta, USA
17:35
MEMS FAST FABRICATION BY SELECTIVE THICK POLYSILICON LAYER
O. de Sagazan, U. de Rennes1 and STMicroelectronics, France
M. Denoual, Biomis Satie ENS Cachan, France
P. Guil, D. Gaudin, STMicroelectronics, Rennes, France
17:40
TWO-AXIS MICRO FLUXGATE SENSOR ON SINGLE CHIP
W-Y. Choi, B-K. Choi, S-H. Kim, Kangnung National U., Korea
J-H. Cho, Changjo Eng., Hwaseong, Korea
17:40
CURRENT FORMULA OF SILICON-GLASS ANODIC BONDING
X. Liu, R. Chuai, W. Chen, Y. Liu, N. Liu, MEMS Center, Harbin Institute of Technology, China
17:45
PIEZORESISTIVE THREE-AXIS ACCELEROMETER FOR MONITORING HEART WALL MOTIONS
C. Lowrie, M. Desmulliez, Heriot-Watt U., Edinburg, UK
Ch. Grinde, Oslo U., Norway
L. Hoff, Vestfold U. College, Norway
17:45
MICROMACHINED SILICON VIA-HOLES AND INTERDIGITAL BANDPASS FILTERS
J. Zhu, B. Zhou, Southeast U., Nanjing, China
Y. Yu, N. Yang, Nanjing Electronic Devices Institute, China
H. Suo, The High-Tech.Research & Development Center, MOST, Beijing, China
17:50
COUPLED-FIELD FEM NONLINEAR DYNAMICS ANALYSIS OF CONTINUOUS MICROSYSTEMS BY NON-INCREMENTAL APPROACH
E. Brusa, A. Collenz, M. Botteon, DIEGM/U. di Udine, Italy
M. Munteanu, Transilvania U. Brasov, Romania
17:50
THE SEEBECK EFFECT FOR NANOMETRIC PT AND AU THIN FILMS
M-C. Salvadori, A. Vaz, F. Teixeira, M. Cattani, U. of São Paulo, Brazil
17:55
RECONFIGURATION TECHNIQUES FOR DIGITAL MICROFLUIDIC BIOCHIPS
F. Su, K. Chakrabarty, Duke U., USA
17:55
CHARACTERISTICS OF ELECTROSTATIC MULTI-LANDING MICROMIRRORS WITH MEANDER SPRINGS IN TERRACED EXTREME DEEP TRENCH
W-I. Jang, M-Y. Jung, C-H. Jun, C-A. Choi, ETRI, Daejeon, Korea
18:00
THERMO-MECHANICAL OPTIMIZATION OF MICROMECHANICAL HOT PLATE FOR RF POWER TO TEMPERATURE CONVERSION
J. Jakovenko, M. Husak, Czech Technical U. in Prague, Czech Republic
T. Lalinsky, Slovak Academy of Sciences, Bratislava, Slovakia
18:00
LAYERED FILM STRUCTURE OF PHOTOVOLTAIC FERROELECTRICS AND ITS APPLICATION TO OPTICAL SENSOR
M. Ichiki, H. Furue, T. Kobayashi, Y. Morikawa, K. Nonaika, R. Maeda, National Institute of Industrial Science and Technology, Ibaraki, Japan
18:05
OPTIMIZATION OF LITHOGRAPHIC MASKS USING GENETIC ALGORITHMS
U. Trilstch, S. Büttgenbach, TU Braunschweig, Germany
18:05
DESIGN AND FABRICATION OF THE REPLACEABLE PACKAGE
C-H. Chien, P-C. Chou, Tatung U., Taiwan
18:10
DESIGN AND FABRICATION OF A NOVEL CRYSTAL SIGEC FAR INFRARED SENSOR WITH THERMAL ISOLATED BY MEMS TEC
M-Ch. Hsieh, D. Jair, K. Shan, U. of Technology, Tainan Hsien, Taiwan
Y-K. Fang, National Cheng Kung U., Taiwan
18:10
PROCESS VALIDATION FOR PLANAR MICROCOILS DEPOSITED ON FLEXIBLE SUBSTRATE
M. Woytasik, E. Dufour-Gergam, S. Megherbi, H. Mathias, J-P. Gilles, E. Martincic, U. Paris Sud, Orsay, France
18:15
ADVANCED PROCESS EMULATION AND CIRCUIT SIMULATION FOR CO-DESIGN OF MEMS AND CMOS DEVI
G. Schröpfer, Coventor, Villebon, France
D. King, M. McNie, QinetiQ, Farnborough UK
Ch. Kennedy, Coventor, Cary, USA
18:15
TEMPERATURE DEPENDANT MICROTENSILE TESTING OF THIN FILM MATERIALS FOR THE APPLICATION OF MEMS
M-T. Lin, National Chung Hsing U., Taichung Taiwan R. Chromik, Naval Research Laboratory, Washington, USA P. El-Deiry, N. Barbosa, R. Vinci, W. Brown, T. Delph, Lehigh University, USA
18:20
CMOS BDJ APS LINEAR ARRAY FOR SPECTROPHOTOMETRY
L. Hannati, P. Pittet, G. Neng Lu, G. Carrillot, U. Claude Bernard Lyon, France
 
18:25
GLOBAL SIMULATION OF SELF POWERED MICRO SYSTEMS
A. Zenati, Y. Ammar, K. Matou, S.Basrour, TIMA Labs, Grenoble, France
18:30
ANALITICAL MODEL FOR MAGNIFIED DISPLACEMENT STRESS TEST STRUCTURES
A. Bagolini, A. Faes, B. Margesin, ITC/IRST, Trento, Italy
18:35
TUNABLE GHZ CIRCUITS WITH NIOBIUM MEMS
M. Schicke, K. Schuster, IRAM, St. Martin d'Hères, France
A. Navarrini, RAL/U. of California, Berkeley, USA
18:45-19:15 EXHIBITION/POSTER VIEWING

19:15-19:45 COCKTAIL

Thursday June 2nd


08:30-10:10
Session 3: TOLERANCE AND QUALITY MANAGEMENT
Chair: M. Ismail, Ohio State Univ., Columbus, USA
Session 4: CHARACTERIZATION AND RELIABILITY
Chair: F. Pressecq, CNES, Toulouse, France
COMPENSATION BY DESIGN OF THERMAL DILATATION IN RF MEMS SWITCHES
Q-H. Duong, D. Collard, L. Buchaillot, IEMN, Villeneuve d'Ascq, France
X. Lafontan, P. Schmitt, Novamems, Saverdun, France
P. Pons, LAAS, Toulouse, France
F. Pressecq, CNES, Toulouse, France
VACUUM MEASUREMENT IN WAFER LEVEL ENCAPSULATIONS BY INTERFERENCE MICROSCOPY
A. Bosseboeuf, J-P. Grandchamp, C. Breluzeau, S. Lani, J. Palomo, H. Mathias, U. Paris Sud, Orsay, France
SIMULATION AND MODELLING OF THE EFFECT OF TEMPERATURE ON THE RESONANCE OF THREE KINDS OF MEMS RESONATORS FABRICATED WITH A THICK POLYSILICON TECHNOLOGY
D. Paci, IEIIT/CNR, Pisa, Italy
A. Nannini, F. Pieri, U. di Pisa, Italy
A CAPACITANCE AND OPTICAL METHOD FOR THE STATIC AND DYNAMIC CHARACTERISATION OF MEMS DEVICES
E. Ferraris, I. Fassi, Institute of Industrial Technology and Automation, Milano, Italia
B. DeMasi, MEMS Business Unit/STMicroelectronics, Cornaredo, Italia
R. Rosing, Lancaster U., UK
TOLERANCE MANAGEMENT COUPLED WITH FE-SIMULATIONS
D. Straube, Ch. Germer, H-J. Franke, TU Braunschweig, Germany
THERMAL CHARACTERISATION OF RADIAL MICRO-CHANNEL COOLING PLATES
G. Horvath, G. Bognar, V. Székely, M. Rencz, BUTE, Budapest, Hungary
M. Desmoulliez, Heriot-Watt U., Edinburg, UK
HOW ESTIMATE THE POLYMER THICKNESS DEPOSITED OVER RESONATOR THROUGH MECHANICAL SIMULATIONS
M. Morata Cariñena, E. Figueras, L. Fonseca, J. Santander, I. Gracia, CNM, Bellaterra, Spain
M. Garcia, I. Sayayo, M-J. Fernandez, M-C. Horrillo, Lab. de Sensores-IFA/CSIC, Madrid, Spain
THERMAL AND THERMO-MECHANICAL CHARACTERIZATION OF MOVABLE STRUCTURES
G. Bognar, G. Horvath, P. Szabo, G. Perlaky, S. Ress, M. Rencz, BUTE, Budapest, Hungary
QUALITY FACTOR MEASUREMENT AND RELIABILITY FOR MEMS RESONATORS
H. Mathias, F. Parrain, J-P. Gilles, S. Megherbi, A. Dupret, U. Paris Sud, Orsay, France
MECHANICAL FAILURE BEHAVIOR OF GLASS FRIT BONDED STRUCTURES
M. Ebert, Fraunhofer Institute for Mechanics of Materials, Halle, Germany
10:10-10:30 Coffee Break
10:30-11:50
Special Session: DESIGN AUTOMATION CHALLENGES FOR MICROFLUIDICS-BASED BIOCHIPS
Chair: S. Blanton,
Carneige-Mellon U., Pittsburgh, USA
Session 6: PACKAGING OF MEMS AND MOEMS
Chair: V. Kempe, SensorDynamics AG, Austria
10:30
T. Mukherjee
10:30
COMPARISON OF ANALYSIS METHODS FOR PACKAGE-INDUCED STRESSES ON MOULDED HALL SENSORS
S. Fischer, S. Hartwig, J. Wilde, IMTEK/U. of Freiburg, Germany
H. Beyer, R. Janke, MICRONAS, Freiburg, Germany
11:00
K. Chakrabarty
10:50
MODELING OF WATER VAPOR PERMEATION INSIDE BCB-SEALED PACKAGES FOR MICROSYSTEMS
D. Veyrié, M. Budinger, A. Tetelin, C. Pellet, IXL/U. Bordeaux, Talence, France
D. Veyrié, J-L Roux, F. Pressecq, CNES, Toulouse, France
11:30
Discussion
11:10
REPLICATION AND BONDING TECHNIQUES FOR INTEGRATED MICROFLUIDIC SYSTEMS
M. Heckele, A. Guber, R. Truckenmüller, FZK/IMT, Karlsruhe, Germany
11:30
SOLDER BONDING WITH A BUFFER LAYER FOR MOEMS PACKAGING USING INDUCTION HEATING
C-Ch. Hu, S-Y. Wen, C-P. Hsu, Y-H. Chien, C-T. Shih, H-W. Lee, Industrial Technology Research Institute, Hsin-Chu, Taiwan
12:00-14:00 Lunch
14:00-14:30
Invited talk of the CAD, Design and Test Conference
STATUS ON CAD FOR MEMS - IS THERE A SUSTAINABLE MARKET ?
M-A. Maher, Softmems, Los Gatos, USA
Chair: G. Wachutka, Munich Univ. of Technology, Germany
Invited talk of the Microfabrication, Integration and Packaging Conference
MEMS PACKAGING FOR AUTOMOTIVE APPLICATIONS
S. Knies, K. Kehr, R. Müller-Fiedler, Bosch, Germany
Chair: E. Jung, IZM, Berlin, Germany
14:30-15:30
Session 5: DESIGN AND ANALYSIS OF OPTICAL MICROSYSTEMS
Chair: T. Veijola, Helsinki Univ. of Technology, Finland
Session 8: ASSEMBLY TECHNOLOGY
Chair: M. Heckele, FZK, Karlsruhe, Germany
PIEZOELECTRIC ACTUATED MULTIPLE CHANNELS OPTICAL SWITCH
G-J. Wang, H-R. Liu, National Chung-Hsing U., Taichung, Taiwan
MICRO ULTRASONIC WELDING - JOINING OF CHEMICALLY INERT, HIGH TEMPERATURE POLYMER MICROPARTS FOR SINGLE MATERIAL FLUIDIC COMPONENTS AND SYSTEMS
R. Truckenmüller, R. Ahrens, Y. Cheng, FZK/IMT, Karlsruhe, Germany
Hs Bahrs, G. Fischer, FHTE, Esslingen, Germany
J. Lehmann, Herrmann Ultraschalltechnik, Germany
MODELING OF THE CMOS GRATING LIGHT MODULATORS FOR IMPROVEMENT ON WAVEFRONT DISTORTION
C-T. Shih, C-P. Hsu, S-Y. Wen, C-C. Hu, Y-H. Huang, H-W. Lee, Opto-Electronics & Systems Labs, Hsinchu, Taiwain
HF-CONTACT ELEMENTS FOR TESTING AND MULTI-CHIP-APPLICATIONS
G. Spanier, E. Slavcheva, W. Mokwa, RWTH-Aachen U., Germany
A NOVEL DESIGN OF 2D MEMS-BASED OPTICAL SWITCH WITH DOUBLE-SIDED MIRRORS
Y. Yin, Beijing U. of Posts and Telecommunications, China
G-S. Kuo, National Chengchi U., Taiwan
GOLD METALLIZATIONS FOR EUTECTING BONDING OF SILICON WAFERS
S. Lani, A. Bosseboeuf, B. Belier, C. Gousset, Ph. Lecoeur, J. Aubert, IEF/U. Paris Sud, Orsay, France
C. Clerc, CSNSM/U. Paris Sud, Orsay, France
15:30-16:00 Coffee Break
16:00-17:30
Session 7: DESIGN AND ANALYSIS OF MINIATURIZED POWER GENERATORS
Chair: S. Basrour, TIMA Labs, Grenoble, France
Session 10: INTEGRATED PROCESSES I
Chair: D. Allen, Cranfield Univ., Bedford, UK
MEMS INERTIAL POWER GENERATORS FOR BIOMEDICAL APPLICATIONS
E. Yeatman, P. Miao, P. Mitcheson, A. Holmes, T. Green, B. Stark, Imperial College London, UK
FABRICATION OF PLANAR AND THREE-DIMENSIONAL MICROCOILS ON FLEXIBLE SUBSTRATES
M. Woytasik, J-P. Grandchamp, E. Dufour-Gergam, E. Martincic, J-P. Gilles, D. Débarre, U. Paris Sud, Orsay, France
DESIGN AND FABRICATION OF PIEZOELECTRIC MICRO POWER GENERATORS FOR AUTONOMOUS MICROSYSTEMS
M. Marzencki, S. Basrour, B. Charlot, TIMA Labs, Grenoble, France
M. Colin, MEMSCAP, Bernin, France
L. Valbin, ESIEE, Noisy le Grand, France
PDMS BONDING AS A HANDSHAKE TECHNOLOGY FOR THE TESTING AND PACKAGING OF MICRO- AND NANOFLUIDIC DEVICES
A. Mercanzini, M. Bachmann, S. Pochon, K. Pataky, H. Shea, N. Stergiopulos, Ecole Polytechnique Fédérale de Lausanne, Switzerland
W. Noell, N. de Rooij, U. de Neuchâtel, Switzerland
A BI-STABLE MICRO-MACHINED PIEZOELECTRIC TRANSDUCER FOR MECHANICAL TO ELECTRICAL ENERGY TRANSFORMATION
K. Dogheche, B. Cavallier, Institut FEMTO-ST/LPMO, Besançon, France
P. Delobelle, L. Hirsinger, Institut FEMTO-ST/LMARC, Besançon, France
E. Cattan, D. Rèmiens, IEMN/DOAE-MIMM, Villeneuve d'Ascq, France
M. Marzencki, B. Charlot, S. Basrour, TIMA Labs, Grenoble France
MICRO POWDER INJECTION MOLDING - PROCESS CHARACTERIZATION AND MODELING
R. Heldele, M. Schulz, Forschungszentrum Karlruhe/IMF-III, Germany
D. Kauzlaric, Albert Ludwig U. of Freiburg, Germany
A NEW HYDRID MICROPOWER SYSTEM FOR AUTONOMOUS MEMS POWERING
C. Navone, B. Laforge, S. Bancel, R. Salot, G. Salvelli, Ch. Salvi, M. Plissonnier, F. Gaillard, CEA, Grenoble, France
DEFECT-FREE WET ETCHING THROUGH PYREX GLASS USING CR/AU MASK
F. Tay, J. Jing, National U. of Singapore, Singapore
C. Iliescu, Institute of Bioengineering and Nanotechnology, Singapore
J. Miao, Nanyang Technological U., Singapore
18:00 Social event
Participants will board a typical paddle-wheel ship for a private cruise on the Leman Lake.

A cocktail will be served on board. Details will be included with the confirmation of your registration. Participation in the social event is included in the registration fee. Additional tickets for companions may be purchased through the registration form.
Additional tickets will be available on-site upon availability.



Friday June 3rd


08:30-10:10
Session 9: ANALYSIS AND TEST OF ELECTROSTATIC ACTUATORS
Chair: R. Laur, Univ. of Bremen, Germany
Session 12: INTEGRATED PROCESSES II
Chair: A. Ionescu, EPFL, Lausanne, Switzerland
8:30
BI-DIRECTIONAL OUT-OF-PLANE MICRO ELECTROSTATIC ACTUATOR
S. He, R. Ben Mrad, U. of Toronto, Canada
8:30
HORIZONTAL BURIED CHANNELS IN MONOCRYSTALLINE SILICON
O. de Sagazan, U. de Rennes1 and STMicroelectronics, France M. Denoual, Biomis Satie ENS Cachan, France P. Guil, D. Gaudin, STMicroelectronics, Rennes, France
2D DEFORMATION OF ARBITRARILY-SHAPED MEMBRANES BY MEANS OF ELECTROSTATIC ACTUATION
J. Juillard, H. Achkar, E. Colinet, SUPELEC, France
SURFACE MICROMACHINED FABRICATION OF PIEZOELECTRIC ALN CLAMPED SUSPENDED BEAMS AND ITS POTENTIAL APPLICATION TO HIGH FREQUENCY (RF) RESONATORS
S. Saravanan, E. Berenschot, G. Krijnen, M. Elwenspoek, U. of Twente, Enschede, The Netherlands
ANALYSIS, TESTING AND OPTIMISATION OF ELECTROSTATIC COMB-DRIVE LEVITATIONAL ACTUATORS
A. Molfese, IEIIT/Sezione di Pisa, Italy
A. Nannini, G. Pennelli, F. Pieri, U. Di Pisa, Italy
COMPARISONS OF VARIOUS PHYSICAL CHARACTERISTICS OF ELECTROFORMED NICKELS AND NICKEL-COBALT ALLOYS AS AN AID FOR THE SELECTION OF MICRO-MOULD INSERT MATERIALS
D. Allen, H. Almond, K. Ake, Cranfield U., UK
N. Hollinshead, Tecan Ltd, Weymouth, UK
ELECTROSTATIC ACTUATORS OPERATING IN LIQUID ENVIRONNEMENT: POSITION CONTROL WITHOUT PULL-IN EFFECT
A-S. Rollier, B. Legrand, D. Collard, L. Buchaillot, IEMN, Villeneuve d'Ascq, France
MODELING AND OPTIMIZATION OF HOT EMBOSSING PROCESS FOR MICRO- AND NANO COMPONENT FABRICATION
M. Worgull, M. Heckele, FZK/IMT, Karlsruhe, Germany J-F. Hétu, K-K. Kabanemi, Industrial Materials Institute, NRC, Canada
MEMS MEMORY BASED ON BI-STABLE MECHANICAL STRUCTURES
O. Français, CNAM/ESCPI, Paris, France
L. Rousseau, T. Bourouina, ESIEE, Noisy le Grand, France
J. Haussy, A. Tissot, CEA/DAM, Bruyères le Châtel, France
ALIGNED WAFER BONDING FOR 3D INTEGRATION
T. Matthias, S. Pargfrieder, P. Lindner, O. Bobenstetter, EV Group, Schaerding, Austria
10:10-10:50 Coffee Break
10:50-12:10
Session 11: DESIGN AND ANALYSIS OF VIBRATION-POWERED MICROGENERATORS
Chair: J. Samitier, Univ. of Barcelona, Spain
10:50-11:30
Session 14: TESTING AND RELIABILITY
Chair: F. Tay, National Univ. of Singapore
DESIGN, FABRICATION AND SIMULATIONS OF MICROELECTROMAGNETIC VIBRATION-POWERED GENERATOR FOR LOW POWER MEMS
S-P. Beeby, M-J. Tudor, E. Koukharenko, N-M. White, Southampton U., UK
T. O'Donnell, C. Saha, S. Kulkarni, S. Roy, NMRC, Cork, Ireland
ULTRA LOW LEAK DETECTION METHOD FOR MEMS DEVICES
F. Gueissaz, ASULAB, Marin, Switzerland
DYNAMIC SIMULATION OF AN IMPLEMENTED ELECTROSTATIC POWER MICRO-GENERATOR
W. Ma, M. Wong, HKUST, Hong Kong
W. Ma, L. Rufer, TIMA Labs, Grenoble, France
DEVELOPMENT OF A SIMPLE MICROSYSTEMS MEMBRANE PROBE CARD
M. Cooke, D. Wood, Microsystems Technology Group, Durham, UK
FABRICATION AND CHARACTERIZATION OF HIGH DAMPING ELECTROSTATIC MICRO DEVICES FOR VIBRATION ENERGY SCAVENGING
G. Despesse, T. Jager, J-J. Chaillout, J-M. Léger, A. Vassilev, CEA-Leti, Grenoble, France
S. Basrour, B. Charlot, TIMA Labs, Grenoble, France
11:30-13:30 Free time
ENERGY STORAGE CAPACITY OF VIBRATING STRUCTURE: APPLICATION TO A SHOCK SYSTEM
B. Cavallier, H. Nouira, E. Foltête, L. Hirsinger, S. Ballandras, FEMTO-ST, Besançon, France
12:10-13:30
Session 13: REDUCED-ORDER METHODS AND COMPACT MODELING
Chair: G-S. Kuo, National Chengchi U., Taipei, Taiwan
SURFACE EXTENSION MODEL FOR MEMS SQUEEZED-FILM DA
T. Veijola, Helsinki U. of Technology, Finland
A. Pursula, P. Raback, CSC, Espoo, Finland
REDUCED ORDER MODELLING OF THE EFFECT OF THE SQUEEZE FILM DAMPING ON MEMS
A. Somà, A. Pennetta, Politecnico di Torino, Italy
G. Spinola, B. de Masi, STMicroelectronics, Italy
COMPACT MODELING OF A MEMS TOGGLE-SWITCH BASED ON MODIFIED NODAL ANALYSIS
J. Iannacci, L. del Tin, R. Gaddi, A. Gnudi, ARCES, Bologna, Italy
K. Rangra, U. of Trento, Italy
MODELLING AND CO-SIMULATION OF A MEMS CAPACITIVE PRESSURE SENSOR WITH CMOS RF OSCILLATOR AS SIGNAL CONDITIONING CIRCUIT
K. Shah, H. Thumu, V. Vibhute, J. Singh, H-Ph. Le, Victoria U., Melbourne, Australia
13:30-15:30 Lunch