1-3 June 2005 - Hôtel Eden au Lac - Montreux, Switzerland.


Microfabrication, Integration and Packaging Conference
Aim of the Conference

This Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks.

Conference Chair: E. JUNG, IZM, Berlin, Germany
Conference Co-Chair: M. ESASHI, Tohoku Univ., Japan

Programme Committee

F. Tay, National Univ. of Singapore
J. Dual, ETH Zentrum, Zürich, Switzerland
M. Heckele, FZK, Karlsruhe, Germany
H. Wicht, Wicht Technologie Consulting, Munich, Germany
D. Allen, Cranfield Univ., Bedford, UK
R. Maeda, MEMS and Packaging Research Group, AIST, Tsukuba, Japan
G.S. Kuo, National Chengchi Univ., Taipei, Taiwan
A. Tay, National Univ. of Singapore
K. Sato, Nagoya Univ., Japan
B. Michel, IZM, Berlin, Germany
C. Khan Malek, Lab. FEMTO-ST/LPMO, Besançon, France
P. Viktorovitch, Ecole Centrale de Lyon/LEOM, Ecully, France
V. Kempe, Sensor Dynamics AG, Austria
H. Hartnagel, TU Darmstadt, Germany
V. Bright, Univ. of Colorado, Boulder, USA
Z-H. Wang, SIMTech., Singapore
P. Nicole, Thales Group, France
H. Yang, National Chung Hsing Univ., Taiwan
D. Collard, CIRMM/IEMN, Villeneuve d'Ascq, France
D. Tolfree, Technopreneur Ltd, Warrington, UK
P. French, TU Delft, The Netherlands
D. Seeger, IBM, Watson Research Center, Yorktown Heights, USA
G-J. Wang, National Chung Hsing Univ., Taiwan
Y. Wang, SIMIT Shanghai, China
T. Bourouina, ESIEE, Noisy le Grand, France
S. Basrour, TIMA Labs, Grenoble, France
K. Bergman, Columbia Univ., New York, USA
A. Ionescu, EPFL, Lausanne, Switzerland

This Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks.

The topics for this Conference include:

• Integrated processes (micromachining, micromolding, ...)
• Process integration between MEMS and electronics
• Microlithography issues unique to MEMS/MOEMS
• Manufacturing
• Materials
• Assembly technologies
• Packaging for harsh environments
• MOEMS packaging
• RF and microwave packaging
• Test structures
• Devices & components (sensors, actuators, ...)
• Dimensional measurements
• Physical measurements
• Failure analysis
• Reliability
• Characterization
• Process monitoring
• Non destructive evaluation
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