1-3 June 2005 - Hôtel Eden au Lac - Montreux, Switzerland.


CAD, Design and Test Conference
Aim of the Conference

This Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks.

Conference Chair: G. WACHUTKA, Munich Univ. of Technology, Germany
Conference Co-Chair: J-M. KARAM, MEMSCAP, Bernin, France

Programme Committee

B. Charlot, TIMA Labs, Grenoble, France
S. Marco, Univ. Barcelona, Spain
M. Rencz, BUTE, Budapest, Hungary
M. Ismail, Ohio State Univ., Columbus, USA
F. Pressecq, CNES, Toulouse, France
R. Laur, Univ. of Bremen, Germany
B. Romanowicz, Nano Science & Technology Inst., Cambridge, USA
R. Rudd, Lawrence Livermore National Lab., Livermore, USA
Y.C. Liang, National Univ. of Singapore
I. Balk, The Ramzay Technologies Inc., Brighton, USA
J. Zhu, Nanjing Electronic Devices Institute, China
J. Samitier, Univ. of Barcelona, Spain
S. Blanton, Carnegie Mellon Univ., Pittsburgh, USA
O. Sigmund, TU of Denmark, Lyngby, Denmark
A. Kaiser, IEMN, Lille, France
A. Wild, Freescale Semiconductor, Grenoble, France
M.A. Maher, SoftMEMS, Los Gatos, USA
B. Vigna , STMicroelectronics, Cornadero, Italy
F. Maloberti, Univ. of Pavia, Italy
Z. Cui, RAL, Didcot, UK
T. Mukherjee, Carnegie Mellon Univ., Pittsburgh, USA
P. Wu, National Chiao Tung Univ., Hsinchu City, Taiwan
C. Cane, CNM, Barcelona, Spain
T. Veijola, Helsinki Univ. of Technology, Finland
A. Richardson, Lancaster University, UK
O. Slattery, NMRC, Cork, Ireland
P. Salomon, 4M2C Patric Salomon, Berlin, Germany
J. Korvink, Univ. of Freiburg, Germany

This Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS.
The participants will also have the opportunity to interact with the other Conference by the means of plenary talks.

The topics for this Conference include (preliminary):

• Technology CAD in general
• Modeling and simulation of fabrication processes
• Devices and components (sensors, actuators, ...)
• MEMS/MOEMS libraries and IP
• Signal processing
• Integrated CAD tools
• Numerical simulation
• Yield estimation
• Failure mechanisms
• Fault modeling
• Fault simulation and test pattern generation
• Mechanical simulation
• Thermal evaluation
• Interoperability of CAD/CAE tools
• Multiphysics simulation
• Structured design methodologies
• Languages for interchange data among designs and tools
• Model order reduction
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