|1-3 June 2005 - Hôtel Eden au Lac - Montreux, Switzerland.|
Invitation to Participate
This Symposium will be a follow-up to the very successful issues held in 1999 and 2000 in Paris, in 2001, 2002 and 2003 in Mandelieu-La Napoule and 2004 in Montreux Switzerland. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions.
The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems.
About 110 submissions were received from 27 countries. The number of papers submitted has again increased since DTIP04.
We look forward to welcoming you to Montreux and encourage you to participate by submitting an abstract for one of the two Conferences.
B. COURTOIS, TIMA Labs, Grenoble, France
K. MARKUS, Zeus Strategies, LLC, Durham, USA