12-14 May 2004 - Hôtel Eden au Lac - Montreux, Switzerland.


Microfabrication, Integration and Packaging Conference
Aim of the Conference

This Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks.

Conference Chair: A. IONESCU, EPFL Lausanne, Switzerland
Conference Co-Chair: M. ESASHI, Tohoku University, Japan

Programme Committee

V. Bright, Univ. of Colorado, Boulder, USA
H. Fujita, Univ. of Tokyo, Japan
R. Maeda, MITI, Tsukuba, Japan
P. Viktorovitch, LEOM, Ecully, France
D. Allen, Cranfield Univ., Bedford, UK
F. Tay, National Univ. of Singapore
D. Tolfree, DRAL, Warrington, UK
A. Tay, National Univ. of Singapore
G.S. Kuo, National Chengchi Univ., Taipei, Taiwan
A.Q. Liu, Nayang Technological Univ., Singapore
M. de Labachelerie, LPMO, Besançon, France
C. Khan Malek, LSAI, Paris, France
J. Jakubczak, Sandia Nat. Labs, Albuquerque, USA
D. Seeger, IBM, Watson Research Center, Yorktown Heights, USA
V. Kempe, Sensor Dynamics AG, Austria
M. Heckele, KFK/IMT, Karlsruhe, Germany
J. Dual, ETH Zurich, Switzerland
J. Walker, USA
H. Yang, National Chung Hsing Univ., Taiwan
N. Meyendorf, Univ. of Dayton, USA
B. Weiss, Univ. of Vienna, Austria
S. Basrour, TIMA Labs, Grenoble, France
K. Sato, Nagoya Univ., Nagoya, Japan
B. Michel, IZM, Berlin, Germany
E. Jung, IZM, Berlin, Germany
D. Collard, IEMN, Villeneuve d'Ascq, France
K. Bergman, Columbia Univ., New York, USA
P. French, TU Delft, The Netherlands
P. Nicole, Thales Group, France
H. Hartnagel, TU Darmstadt, Germany
H. Wicht, Wicht Technologie Consulting, München, Germany

The topics for this Conference include:

  • Integrated processes (micromachining, micromolding, ...)

  • Process integration between MEMS and electronics

  • Microlithography issues unique to MEMS/MOEMS

  • Manufacturing

  • Materials

  • Assembly technologies

  • Packaging for harsh environments

  • MOEMS packaging

  • RF and microwave packaging

  • Test structures

  • Devices & components (sensors, actuators, ...)

  • Dimensional measurements

  • Physical measurements

  • Failure analysis

  • Reliability

  • Characterization

  • Process monitoring

  • Non destructive evaluation

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