12-14 May 2004 - Hôtel Eden au Lac - Montreux, Switzerland.
Sponsored by In cooperation with

CNRS-INPG-UJF


IEEE Computer Society


The Institute of Electrical and Electronics Engineers, Inc.


Test Technology Technical Council


IEEE Circuits and Systems Society

Chair: Bernard COURTOIS, TIMA Labs, Grenoble, France
Co-Chair:
Karen MARKUS, Zeus Strategies, LLC, Durham, USA

Conferences Invitation to participate

CAD, Design and Test

Chair: J. KORVINK,
University of Freiburg, Germany

Co-Chair: J.M. KARAM,
MEMSCAP, Bernin, France

Microfabrication, Integration and Packaging

Chair: A. IONESCU,
EPFL Lausanne, Switzerland

Co-Chair: M. ESASHI,
Tohoku University, Japan

This Symposium will be a follow-up to the very successful issues held in 1999 and 2000 in Paris and in 2001, 2002 and 2003 in Mandelieu-La Napoule. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems.

We look forward to welcoming you to Montreux and encourage you to participate by submitting an abstract for one of the two Conferences.

B. COURTOIS
K. MARKUS

Including

Workshop on MEMS packaging
organized by E. JUNG, IZM, Berlin, Germany

Submission of abstracts

31 October 2003

Conferences
CAD, Design and Test Microfabrication, Integration
and Packaging
Chair: J. KORVINK, University of Freiburg, Germany

Co-Chair: J.M. KARAM, MEMSCAP, Bernin, France

Programme Committee

I. Balk, the Ramzay Technologies Inc, Brighton, USA
A. Kaiser, IEMN, Lille, France
A. Wild, Motorola, München, Germany
B. Vigna , STMicroelectronics, Cornadero, Italy
B. Charlot, TIMA, Grenoble, France
B. Romanovicz, Applied Comput. Res. Society, Cambridge, USA
S. Blanton, Carnegie Mellon Univ., Pittsburgh, USA
C. Cane, Univ. of Barcelona, Spain
Y.C. Liang, National Univ. of Singapore
P. Wu, National Chiao Tung Univ., Hsinchu City, Taiwan
F. Maloberti, Texas A&M Univ., College Station, USA
M. Ismail, Ohio State Univ., Columbus, USA
D. Keating, Corning Intellisense, Wilmington, USA
R. Laur, Univ. Bremen, Germany
M.A. Maher, MemsCap Inc., San Jose USA
F. Pressecq, CNES, Toulouse, France
M. Rencz, BUTE, Budapest, Hungary
R. Rudd, Lawrence Livermore National Lab., Livermore, USA
J. Samitier, Univ. of Barcelona, Spain
M. Santiago, Univ. Barcelona, Spain
O. Sigmund, TU of Denmark, Lyngby, Denmark
T. Bourouina, ESIEE, Noisy le Grand, France
T. Mukherjee, Carnegie Mellon Univ., Pittsburgh, USA
T. Veijola, Helsinki Univ. of Technology, Finland
G. Wachutka, TU München, Germany
Z. Cui, RAL, Didcot, UK

This Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS.
The participants will also have the opportunity to interact with the other Conference by the means of plenary talks.

The topics for this Conference include (preliminary):

  • Technology CAD in general

  • Modeling and simulation of fabrication processes

  • Devices and components (sensors, actuators, ...)

  • MEMS/MOEMS libraries and IP

  • Signal processing

  • Integrated CAD tools

  • Numerical simulation

  • Yield estimation

  • Failure mechanisms

  • Fault modeling

  • Fault simulation and test pattern generation

  • Mechanical simulation

  • Thermal evaluation

  • Interoperability of CAD/CAE tools

  • Multiphysics simulation

  • Structured design methodologies

  • Languages for interchange data among designs and tools

  • Model order reduction

Chair: A. IONESCU, EPFL Lausanne, Switzerland

Co-Chair: M. ESASHI, Tohoku University, Japan

Programme Committee

V. Bright, Univ. of Colorado, Boulder, USA
H. Fujita, Univ. of Tokyo, Japan
R. Maeda, MITI, Tsukuba, Japan
P. Viktorovitch, LEOM, Ecully, France
D. Allen, Cranfield Univ., Bedford, UK
F. Tay, National Univ. of Singapore
D. Tolfree, DRAL, Warrington, UK
A. Tay, National Univ. of Singapore
G.S. Kuo, National Chengchi Univ., Taipei, Taiwan
A.Q. Liu, Nayang Technological Univ., Singapore
M. de Labachelerie, LPMO, Besançon, France
C. Khan Malek, LSAI, Paris, France
J. Jakubczak, Sandia Nat. Labs, Albuquerque, USA
D. Seeger, IBM, Watson Research Center, Yorktown Heights, USA
V. Kempe, Sensor Dynamics AG, Austria
M. Heckele, KFK/IMT, Karlsruhe, Germany
J. Dual, ETH Zurich, Switzerland
J. Walker, USA
H. Yang, National Chung Hsing Univ., Taiwan
N. Meyendorf, Univ. of Dayton, USA
B. Weiss, Univ. of Vienna, Austria
S. Basrour, TIMA, Grenoble, France
K. Sato, Nagoya Univ., Nagoya, Japan
B. Michel, IZM, Berlin, Germany
E. Jung, IZM, Berlin, Germany
D. Collard, IEMN, Villeneuve d'Ascq, France
K. Bergman, Columbia Univ., New York, USA
P. French, TU Delft, The Netherlands
P. Nicole, Thales Group, France
H. Hartnagel, TU Darmstadt, Germany
H. Wicht, Wicht Technologie Consulting, München, Germany

This Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks.

The topics for this Conference include (preliminary):

  • Integrated processes (micromachining, micromolding, ...)

  • Process integration between MEMS and electronics

  • Microlithography issues unique to MEMS/MOEMS

  • Manufacturing

  • Materials

  • Assembly technologies

  • Packaging for harsh environments

  • MOEMS packaging

  • RF and microwave packaging

  • Test structures

  • Devices & components (sensors, actuators, ...)

  • Dimensional measurements

  • Physical measurements

  • Failure analysis

  • Reliability

  • Characterization

  • Process monitoring

  • Non destructive evaluation

Plenary invited talks

Plenary invited talks given by prominent speakers will include:

K. MURATA,
National Institute of Advanced Industrial Science and Technology Nanotechnology Research Institute,
Ibaraki, Japan
Super-fine inkjet printing -toward the minimal manufactuaring system-

A super-fine inkjet system which allows arrangements of dots with a minimum size of less than one micron has been developed. We will show the possibility toward the minimal manufacturing system.

Gary K. FEDDER,
Carnegie Mellon University,
USA
RF MEMSoC

The demand for low-power embedded wireless capability is driving a trend to make more sophisticated and better performing RF systems on chip. Advances in CMOS and BiCMOS micromachining has led to recent work on MEMS-enabled RF circuits that exploit on-chip passives with superior quality factor and tuning capabilities.

F. UDREA,
Cambridge University,
UK
SOI gas sensing microsystems

The development of solid state gas sensors and their gradual transition to smart CMOS technology will be reviewed, follow by a detailed discussion of advantages/disadvantages of using SOI micromachning technology compared to standard bulk technology. New concepts in SOI microsystems such as use of CMOS compatible layers for micro-hotplates will also be described. The presentation will end with a discussion on the use of smart gas sensors in high volume wireless applications.

T. MATTILA,
VTT Information Technology,
Finland
Quartz Challenged by Silicon Micromechanics

Despite the ongoing digitalization, an analog frequency reference is required in every wireless transceiver for the foreseeable future. The conventional solution relies on quartz crystals that appear bulky in the otherwise highly integrated architectures. The presentation will describe the recent advances in the silicon microresonator technology - in particular, how the short- and long-term frequency stability can be realized in the miniature size.

Contacts
Bernard COURTOIS
TIMA
Tel.: +33 476 574 615
Fax: +33 476 473 814
Karen MARKUS
Zeus Strategies
Tel.: +1 919 806 4682
Fax: +1 919 806 4990

Exhibition

An exhibition will be organized in the framework of the Symposium.
CAD software, products, equipments, instruments, foundries offerings, ...etc, may be exhibited. Exhibitors who will register early enough will be given the opportunity to give a product presentation during the vendor session that will be placed in the Symposium programme.
If you plan to exhibit, please contact the Symposium Chair.

Specific Events Sponsoring

If you wish to sponsor an event like a reception, a lunch, or any specific event during the Symposium, please contact the Symposium Chair.

Advertising in the programme booklet

The programme booklet will be widely distributed to announce the Symposium. If you wish to advertise in the programme booklet, please contact the Symposium Chair.

Location

The Symposium will be held at the Hôtel Eden au Lac in Montreux, Switzerland.
On the shores of lake Geneva, the Hôtel Eden au Lac overlooks the lake and the majestic Alps to the south.
The hotel is less than an hour away from Geneva airport. The distance from Geneva international airport is 90km.

  • Time & cost by taxi: approx. 45 minutes & approx. SFr 300.

  • Time & cost by train: approx. 70 minutes & approx. - second class SFr 31, first class SFr 52.

Hôtel EDEN AU LAC
11, rue du Théâtre
CH - 1820 Montreux
Switzerland

Tel.: +41 21 966 0 800
Fax: +41 21 966 0 900

Paper Review

To ensure a high-quality Symposium, all abstracts will be reviewed by the Programme Committee members under the leadership of the Conference Chairs, and the Proceedings papers will be reviewed by the Conference Chairs for technical merit and content.

Oral or Poster Presentation

Submitted papers may be selected for oral or poster presentation. All oral and poster presentations will be included in the Symposium Proceedings.

Submission of Abstracts

Your abstract must include the following:

  • ABSTRACT TITLE

  • AUTHOR LISTING (principal author first)
    First (given) name, Last (family) name, and affiliations, mailing address, telephone, fax and e-mail address.

  • PRESENTATION
    Indicate your preference for "Oral Presentation" or "Poster Presentation".
    Placement is subject to chair's discretion.

  • ABSTRACT TEXT
    Not less than 250 words, preferably 1500 words.

  • KEY WORDS
    List a maximum of five key words.

  • BRIEF BIOGRAPHY (of principal author)
    Approximately 50 words.

Submission will be electronically only.

Detailed instructions will be posted in due time on the Symposium web site.
Questions may be directed in the meantime by email (dtip@mycmp.fr).

Conditions of Acceptance

Authors are expected to secure registration fees and travel and accommodation funding, through their sponsoring organizations, before submitting abstracts.
Abstracts should contain enough detail to clearly convey the approach and the results of the research.
Government and company clearance to present and publish should be final at the time of submittal.
Commercial papers with no research, presenting products, cannot be submitted to the Symposium. Such papers can be presented in the framework of the exhibition (see corresponding section).

Special Issues of Journals and Magazines

It is a tradition that Special Issues of Journals and Magazines are published after the Symposium. These Special Issues collect revised versions of papers presented during the Symposium.
DTIP 2004 Special Issues will be organized in the Journal of Microsystem Technologies and in the Journal of Analog Integrated Circuits and Signal Processing.

Proceedings

Proceedings of this symposium will be available at the meeting as part of the registration fee.

Copyright © 2003 Laboratoire TIMA.
Tous droits réservés.