|12-14 May 2004 - Hôtel Eden au Lac - Montreux, Switzerland.|
|Aim of the Symposium
This Symposium will be a follow-up to the very successful issues held in 1999 and 2000 in Paris and in 2001, 2002 and 2003 in Mandelieu-La Napoule. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems.
The Symposium is sponsored by the IEEE Computer Society Test Technology Technical Council, TIMA Labs, in cooperation with, the IEEE Circuits and Systems Society in collaboration with the French Chapter.
We look forward to welcoming you to Montreux.