Technical Programme

Sunday 5 May 2002

13:00-19:00 Meeting of NEXUS User-Supplier Club "Design and Simulation (USC CAD)"
The NEXUS USC CAD brings together commercial and academic suppliers of microsystems design tools and their users. Design flows of industry-oriented microsystems designers and their future needs will be discussed. Design tool suppliers will give an update on their latest features. The aim of the meeting is to discuss a Òmicrosystems design tool roadmapÓ between suppliers and users of design tools. The meeting is open to further participants who like to contribute to the discussion. In addition to design tool experts, we encourage design tool users to participate and discuss their design flows including problems and demands.
Participation is free of charge, but due to limited space, advance registration by email to P. Salomon is required.
A Workshop on Design Approaches for MEMS will take place on Tuesday 7 May.
Coordination: P. Salomon (NEXUS USC CAD Coordinator), Berlin, Germany

Monday 6 May

8.30-9.15 Registration

9.15-9.30 Opening
B. Courtois, TIMA, Grenoble, France

9.30-10.10 Invited talk 1: "Power and integrated microsystems"
K. Najafi, University of Michigan, USA
Chair: K. Markus, JDS Uniphase, Research Triangle Park, USA

10.10-10.50 Invited talk 2: "Microoptical phased arrays for spatial and spectral switching"
O. Solgaard, Stanford University, USA
Chair: J. Walker, Tellium Inc., Oceanport, USA

10.50-11.20 Break

11.20-12.20 Posters introduction - I
CAD, Design and Test
posters are introduced by one slide in 3 minutes each.
They are dealing with the following topics: Optimization, Design, Design and Characterization.
Chair: M. Rencz, BUTE, Budapest, Hungary
Microfabrication, Integration and Packaging
posters are introduced by one slide in 3 minutes each.
They are dealing with the following topics: Packaging, Reliability and Characterization.
Chair: A.Q. Liu, Nanyang Technological University, Singapore
Application of a computer-supported method for design optimization on an IR gas sensor
I. Sieber, Forschungszentrum Karlsruhe, Eggenstein-Leopoldshafen, Germany
K.-H. Suphan, Micro-Hybrid Electronic GmbH, Hermsdorf, Germany
O. Nüssen, University Bremen, Germany
Wafer level packaging solution for pressure sensors
C. Iliescu, J. Miao, Nanyang Technological University, Singapore
Optimisation of the planar pellistor using finite element analysis
G. McRobbie, F. Clark, University of Paisley, United Kingdom
Ch. Tandy, Inchinnan Industrial Estate, Renfrewshire, United Kingdom
Better quality of soldered joints through rapid laser-beam reflowing
F. Herbert, L. Dorn, TU Berlin, Germany
MOSCITO - a program system for MEMS optimization
P. Schneider, A. Schneider, J. Bastian, P. Schwarz, Fraunhofer-Institut für Integrierte Schaltungen, Dresden, Germany
Example of simultaneous alignment, packaging and interconnection of MEMS stacks
H.S. Gross, D.A. Crewe, ETEC Systems, Inc., Hayward, USA
Efficient and reliable design of microsystems
D. Peters, S. Rehfu§, H. Bolte, O. Nüssen, R. Laur, University of Bremen, Germany
MOEMS and micro-mechatronic packaging by means virtual and rapid prototyping processes
F. Ansorge, H. Hanisch, J. Wolter, C. Rebholz, G. Mayr, B. Michel, H. Reichl, Fraunhofer IZM, Berlin, Germany
Behavioural Modeling of Medical Test Stripes for Optimisation
H. Bolte, D. Peters, O. Nüssen, R. Laur, University of Bremen, Germany
Reduction of spurious resonance in RF package using silicon micromachining
W. Choi, J. Lee, S. Moon, S. Seok, K. Chun, Seoul National University, Korea
Efforts in developing design and simulation tools for MEMS: DS/MEMS & CA/MEMS
S-K. Youn, B. Kwak, J-H. Kwon, S-Y. Chang, J. Huh, E. Kim, KAIST, Taejon, Republic of Korea
Reliability of packaged MEMS in shock environment: crack, stiction modelling
L. Buchaillot, O. Millet, ISEN, Villeneuve d'Ascq, France
The development of a new contact type piezoresistive micro-shear-stress sensor
M.C. Hsieh, Y.K. Fang, M.S. Ju, S.F. Ting, National Cheng Kung University, Taiwan
J.J. Ho, Fortune Junior College of Technology & Commerce, Taiwan
Method to determine the residual stresses in MEMS handing structures
S. Rigo, J-M. Desmarres, F. Pressecq, CNES, Toulouse, France
T. Masri, ENIT, Tarbes, France
X. Lafontan, Ch. Le-Touze, MEMScAP, Saint-Ismier, France
Dynamics simulation of MEMS device embedded hard disk drive system
J. Yang, S. Chen, Data Storage Institute, Singapore
Microstructure defect detection using thermal response
B. Olson, K. Chen, University of Utah, Salt Lake City, USA
Design and simulation of a new planar OADM component
H. Yang, R. Chein, D.-M. Sue, National Chung Hsing University, Taichung, Taiwan
W.-C. Chung, National Huwei Institute of Technology, Taiwan
C.-T. Pan, Y.-H. Chao, MIRL, Hsinchu, Taiwan
Experimental determination of micromachined discrete and continuous device spring constants using nanoindentation method
E.H.F. Tay, C.M. Lin, V.J. Logeeswaran, National University of Singapore, Singapore
Z. Kaiyang, S. Lu, Institute of Materials Research and Engineering, Singapore
Design of a CMOS BDJ detector array for fluorescence imaging application
G. Sou, University of Pierre & Marie Curie, ParisVI, France
G.N. Lu, LENAC, Villeurbanne, France
Micro/nanoDAC deformation measurement to analyse packaging components response to thermo-mechanical load
D. Vogel, A. Gollhardt, B. Michel, Fraunhofer IZM, Berlin, Germany
High performance MEMS micro-Gyroscope
S.Y. Bae, D.V. Wiberg, K.J. Hayworth, K.Y. Yee, Jet Propulsion Laboratory, Pasadena, USA
 
Design of a real time VLSI optical centroid processor
B.H. Pui, B. Hayes-Gill, M. Clark, M. Somekh, C. See, S. Morgan, A. Ng, University of Nottingham, United Kingdom
 
A Frequency selective silicon vibration sensor with direct electrostatic stiffness modulation
D. Scheibner, J. Mehner, B. Brämer, T. Gessner, W. Dötzel, Chemnitz University of Technology, Germany
J. Wibbeler, CADFEM GmbH D-85567 Grafing, Germany
 
Characterization of the bolometer infrared sensors
P. Neuzil, Institute of Microelectronics, Singapore
T. Mei, Nanyang Technological University, Singapore
 
Perspectives of microsystems engineering development in Russia
P.P. Maltsev, Moscow State Institute of Radioengineering, Russia
 
Design of a closed loop control circuit for MEMS micromotor
A. Mohamed, H. Elsimary, Electronics Research Institute, Cairo, Egypt
M. Ismail, Ohio State University, USA
 

12.30 Lunch

14.00-16.00
Session 1: Analysis tools and methods
Chair: J.G. Korvink,
University of Freiburg, Germany
Session 2: Components for communications applications
K. Bergman,
Tellium Inc., Oceanport, USA
Improved convergence of electromechanical transducer element
R. Sattler, G. Wachutka, Munich University of Technology, Germany
Fabrication of optical switch arrays with auto-aligning fibers and latching micro-mirrors
H. Yang, National Chung Hsing Unviersity, Taichung, Taiwan
C.- T. Pan, MIRL, Hsinchu, Taiwan
S.C. Shen, National Tsing Hua University, Hsinchu, Taiwan
New approach for 3-D capacitance extractions for complex structures with conformal dielectrics
A. Ushakov, I. Landman, Corning Ltd., Saint Petersburg, Russia
I. Balk, IntelliSense Corp., Wilmington, USA
Monolithic tuneable InP-based vertical cavity surface emitting laser
J-L. Leclercq, P. Regreny, P. Viktorovitch, LEOM, Ecully, France
A. Bakouboula, T. Benyattou, INSA Villeurbanne, France
I. Sagnes, G. Saint-Girons, C. Mériadec, A. Mereuta, LPN, Bagneux, France
A. Plais, J. Jacquet, OPTO+, Marcoussis, France
Integration of a network solver and a field solver for the mixed level thermal simulation of MEMS problems
M. Rencz, A. Poppe, MicReD Ltd., Hungary, Hungary
V. Székely, Technical University of Budapest, Hungary
Phase matching pseudo-resonant tuneable InP-based MOEMS
D. Zhou, Tsinghua University, Beijing, China
K. Sun, M. Garrigues, J-L. Leclercq, P. Regreny, P. Viktorovitch, LEOM, Ecully, France
C. Pautet, S. Cortial, J.P. Moy, X. Hugon, ATMEL Opto, Saint Egrève, France
Calculation of inductances and capacitances for 3D-structures using Prony's method
S. Rehfu§, G. Gorecki, C. Marschner, D. Peters, R. Laur, University of Bremen, Germany
Large-scale metal MEMS mirror arrays with integrated electronics
T. Bifano, S. Cornellisen, J. Perreault, M. Horenstein, A. Hubbard, Boston University, USA
P. Bierden, Clara Dimas, Boston Micromachines Corp., Watertown, USA
M. Miller, Michigan Technological University, USA
Surface tension defects in micro-fluidic self-alignment
J. Lienemann, A. Greiner, J.G. Korvink, IMTEK, Freiburg, Germany
Polysilicon surface micro-machined spatial light modulator with novel electronic integration
C. Dimas, P. Bierden, Boston Micromachines Corp., Watertown, USA
T. Bifano, J. Perreault, S. Cornelissen, Boston University, USA
R. Roehnelt, MicroAssembly Technologies, USA
P. Krulevitch, Lawrence Livermore National Laboratory, USA
System C-based cosimulation for global validation of MOEMS
L. Kriaa, W. Youssef, G. Nicolescu, S. Martinez, A.A. Jerraya, B. Courtois, TIMA, Grenoble, France
S. Levitan, J. Martinez, T. Kurzweg, University of Pittsburgh, USA
An MEMS variable optical attenuator (VOA) for DWDM applications
X.M. Zhang, A.Q. Liu, C. Lu, D.Y. Tang, Nanyang Technological University, Singapore

16.00-16.30 Break

16.30-17.30 Vendors session
Chair: B. Courtois,
TIMA, Grenoble, France
Those exhibitors who have booked a stand at the time of printing the programme will introduce their products in a 8 minute presentation.
Heidelberg Instruments - MicReD - CMP- MEMScAP - Tronic's - EV Group - Coventor - Boston Micromachines - Corning IntelliSense - Fogale Nanotech - Kluwer - Micro Materials Center - Alcatel Optronics - COLIBRYS.

17.30-18.30 Posters Viewing - I / Exhibition
18.30-19.30 Cocktail / Exhibition

Tuesday 7 May


8.30-9.10 Invited talk 3: "The "Millipede" -more than 1000 tips for a M(N)EMS based scanning- probe data storage"
M. Despont, IBM Research Divison, Zurich Reserach Laboratory, Rueschlikon, Switzerland
Chair: T. Mukherjee, Carnegie Mellon University, Pittsburgh, USA

9.10-10.40 Workshop on Design Approaches for MEMS organized by NEXUS
At the pre-conference workshop on 5 May, the NEXUS USC CAD brings together commercial and academic suppliers of microsystems design tools and their users to discuss design flows of industry-oriented microsystems designers and their future needs.
This Workshop during the Symposim will give a summary of NEXUS USC CAD activities and a first outlook on a MEMS design tool roadmap. Experienced MEMS designers from industry and research will give an insight into their individual design approaches and discuss their needs in terms of design tool features.
  • Coordinator: P. Salomon, MEMScAP GmbH, Berlin, Germany
  • Moderator: T. Mukherjee, Carnegie Mellon University, USA

10.40-11.00 Break

14.00-15.40
Session 3: Design and characterization
Chair: Ch. Dufaza,
Université de Provence, Marseille, France
Session 4: Packaging and assembly
Chair: V. Kempe,
AMS, Unterpremstatten, Austria
Design and experiment of silicon PCR chips
Z. Cui, RAL, Didcot, United Kingdom
Z. Zhao, The State Key Laboratory of Transducer Technology, Beijing, China
Packaging solutions for MEMS/MOEMS using thin films as mechanical components
P. Boyle, D.F. Moore, Cambridge University, United Kingdom R.R.A. Syms, Imperial College London, United Kingdom
Low-loss microstrip MEMS technology for passive components design in the ka-band
L. Martoglio, E. Richalot, O. Picon, University of Marne-la-Vallée, Champs-sur-Marne, France
Packaging for MEMS devices - stumbling block or enabling solution ?
E. Jung, V. Grosser, J. Wolf, Fraunhofer IZM, Berlin, Germany
M. Wiemer, Fraunhofer IZM, Chemnitz, Germany
K. Bock, Fraunhofer IZM, Munich, Germany
Modelling of flow sensor based on thermal time-of-flight mode
K. Trieu, H. Vogt, Fraunhofer Institute for Microelectronic Circuits and Systems, Duisburg, Germany
I. Hariadi, Inter University Research Center on Microelectronics, Bandung, Indonesia
Parameterized FE-modeling and interfacial fracture toughness investigations towards reliability enhancements of advanced plastic packages
J. Auersperg, R. Dudek, B. Michel, Fraunhofer IZM, Berlin, Germany
J. Auersperg, AMIC, Berlin, Germany
Design and characterization of levitated suspended RF inductors
B. Palan, K. Torki, B. Courtois, TIMA, Grenoble, France
M. Husak, Czech Technical University, Prague, Czech Republic
Packaging of large-area, individually addressable, micro-mirror arrays for the next generation space telescope
G-Q. Lu, J. Calata, S. Wen, State University, Blacksburg, USA
S. Dutta, Y. Zheng, C. Stahl, P. Shu, NASA/Goddard Space Flight Center, Greenbelt, USA
A CAD tool for the design and manufacturing of freeform micro-EDM electrodes
W. Meeusen, D. Reynaerts, H. Van Brussel, Katholieke University of Leuven, Belgium
Handling of microoptical components for microassembly
E. Beckert, M. Mohaupt, G. Harnisch, R. Eberhardt, Fraunhofer Institut für Angewandte Optik und Feinmechanik, Jena, Germany

12.45 Lunch

14.15-15.35
Session 5: Manufacturing variations and tuning
Chair: F. Maloberti,
University of Texas at Dallas, USA
Session 6: Devices and components
Chair: J. Jakubczak,
Sandia National Laboratory, Albuquerque, USA
Modeling methodology for a CMOS-MEMS electrostatic comb
S. Iyer, H. Lakdawala, T. Mukherjee, G.K. Fedder, Carnegie Mellon University, Pittsburgh, USA
Development of a new 1X4 micro optical switch
Z.F. Wang, X.C. Shan, Z.P. Wang, Gintic Institute of Manufacturing Technology, Singapore
S.P. Lim, K.H. Lee, National University of Singapore, Singapore
Parametric yield optimization of MEMS
F. Delauche, B. Affour, MEMScAP, Saint-Ismier, France
F. Delauche, Ch. Dufaza, LIRMM, Montpellier, France
Low cost thermal flow sensor for home-appliances applications
N. Sabaté, I. Gràcia, C. Cané, CNM-CSIC, Bellaterra, Spain
J. Berganzo, IKERLAN, Gipuzkoa, Spain
J. Puigcorbé, J.R. Morante, University of Barcelona, Spain
Architecture-level center frequency drift compensation method for micro-mechanical filters used in IF stages of wireless telecommunication receivers
O. Billoint, D. Galayko, B. Legrand, A. Kaiser, IEMN-ISEN, Lille, France
MEMS/NEMS development for space applications at NASA/JPL
T. George, Jet Propulsion Laboratory, Pasadena, USA
Influence of process variation on the functionality of a high pressure sensor
J. Muchow, A. Kretschmann, R. Henn, K. Skrobanek, S. Finkbeiner, H.R. Krauss, Robert Bosch GmBH, Reutlingen, Germany
A CMOS compatible micromachined tactile fingerprint sensor
F. Parrain, B. Charlot, N. Galy, B. Courtois, TIMA, Grenoble, France

15.35-16.30 Posters introduction - II
CAD, Design and Test
posters are introduced by one slide in 3 minutes each.
They are dealing with the following topics: Optimization, Design, Design and Characterization.
Chair: A. Kaiser, IEMN-ISEN, Lille, France
Microfabrication, Integration and Packaging
posters are introduced by one slide in 3 minutes each.
They are dealing with the following topics: Packaging, Reliability and Characterization.
Chair: M. de Labachelerie, LPMO, Besançon, France
System level simulation of acoustic devices
A. Wilde, P. Schneider, Fraunhofer Institut für Integrierte Schaltungen, Dresden, Germany
LCD real-time mask technique for fabrication of arbitrarily shaped microstructure
Q. Peng, Y. Guo, B. Chen, J. Du, J. Xiang, Sichuan University, China
Z. Cui, RAL, Didcot, United Kingdom
InP MOEMS VCSEL design and characterization for WDM applications
A. Bakouboula, T. Benyattou, LPM - INSA, Villeurbanne, France J-L. Leclercq, P. Regreny, P. Viktorovitch, LEOM - ECL, Ecully, France
I. Sagnes, G. Saint-Girons, C. Mériadec, A. Mereuta, LPN, Bagneux, France
Fractional Fourier domain filtering applied to improve image quality in photolithography
Y. Zhang, J. Du, J. Yang, Y. Zeng, Y. Guo, Sichuan University, Chengdu, China
Z. Cui, RAL, Didcot, United Kingdom
On computational of the potential due to the distribution of the sources and normal dipoles over a flat panel
A. Ushakov, I. Landman, Corning Ltd., Saint Petersburg, Russia
I. Balk, IntelliSense Corp., Wilmington, USA
Computational of the potential due to the distribution of the sources and normal dipoles over a flat panel
M. Jozwik, A. Sabac, C. Gorecki, Laboratoire d"Optique
P.M. Duffieux, Besanon, France
Tolerance analysis in micro systems
Chr. Germer, H.-J. Franke, S. Büttgenbach, Institute for Engineering Design, Braunschweig, Germany
U. Hansen, Institute for Mircotechnology, Braunschweig, Germany
Fabrication and modeling of the gray-scale mask based nonspherical refraction microlens array
G-J. Wang, C-H. Chin, National Chung-Hsing University, Taichun, Taiwan
S-Y. Wang, Cheng-Shiu Institute of Technology, Kaohsiung, Taiwan
System level modeling of microsystems using order reduction methods
S. Reitz, J. Bastian, J. Haase, P. Schneider, P. Schwarz, Fraunhofer Institute for Integrated Circuits, Dresden, Germany
Fabrication of suspended membranes for thermal sensors using high-density plasma etching
A. Tserepi, C. Tsamis, A. Nassiopoulou, NCSR "Demokritos", Athens, Greece
Signal flow strength in circuit simulation and its application
Ch. Chen, W-P. Tai, J-D. Sun, Chinese Culture University, Taipei, Taiwan
PMMA microstructures using O2 RIE fabrication
A.B. Yu, A.Q. Liu, Nanyang Technological University, Singapore
C.S. Yang, G.F. Ding, Shanghai Jiao Tong University, China
Behavioural modelling of microfluidical characteristics in medical test stripes
O. Nuessen, H. Bolte, D. Peters, R. Laur, University of Bremen, Germany
Application of deep trench LISA technology on optical switch fabrication
Q. Zhang, Y. Miao, Institute of Microelectronics, Singapore
J. Li, A.Q. Liu, Nanyang Technological University, Singapore
Analysis of microsprings for calculating the force produced by microactuators
L. Li, D.G. Uttamchandani, University of Strathclyde, Glasgow, United Kingdom
Scalable free-space optical switches based on MEMS vertical mirrors
W. Wang, R. Lin, Nanyang Technological University, Singapore
Energy trapping in quartz mesa structures
F. Shen, P. Lu, K. H. Lee, T.Y. Ng, Institute of High Performance Computing, Singapore
S.J. O'Shea, Institute of Materials Research & Engineering, Singapore
Bimorph actuators for MOEMS
V. Djakov, S.E. Huq, RAL, Didcot, United Kingdom
Microstructures under electrostatic loads: FEM analysis of the geometrically non-linear problem
A. Gugliotta, A. Somà, Politecnico di Torino, Italy
F. De Bona, University of Udine, Italy
A high power electromagnetic microactuator for micro-optical switch applications
S-C. Shen, C-T. Pan, H-P. Chou, National Tsing Hua University, Taiwan
MEMS Max: a new full 3D, MEMS featured, RF-FEM analysis environement
F. Mohamed, B. Affour, S. Despreaux, B. Guillon, P. Giroud, MEMScAP, Saint-Ismier, France
Piezocrystal transformers for measuring static mechanical stresses in situ
V.V. Baranov, V.I. Zubtsov, Belarusian State University of Informatics and Radioelectronics, Minsk, Belarus
Efficient MEMS design methodology integrating finite elements based macro models into a nodal approach MEMS component design tool
D. Moulinier, P. Nachtergaele, M-P. Brutails, S. Bergeon, S. Maza, Ch. Hui Bon Hoa, MEMScAP, Saint-Ismier, France
A reflectively-tuned x-band capacitive switch
M. Tang, J.M. Huang, A.Q. Liu, Nanyang Technological University, Singapore
Multiphysics, multiscale design tools for microfluidic biochips with electronic and optical readout
A. Przekwas, CFD Research Corp., Huntsville, USA
 
Characterization of MEMS by feedback interferometry
V. Annovazzi-Lodi, S. Merlo, M. Norgia, University of Pavia, Italy
G. Spinola, B. Vigna, S. Zerbini, STMicroelectronics, Cornaredo, Italy
 
Optical interferometric detection of a mechanical silicon oscillator
K. Nera, O. Hahtela, S. Franssila, I. Tittonen, Helsinki University of Technology, Finland
 

16.30-16.50 Break

16.50-18.20 Workshop on MEMS/MOEMS Business Development

MEMS: Where are we going ? An Insight view from executives and analysts.

During the last years, MEMS industry and market have won maturity and structure. We have seen companies getting acquired by global providers, other going public, providing market comparables for investors in the field. Industry leaders are starting to emerge and business models to anchor.

This panel will put together analysts covering the sector with executives from key industry players. Presentations and discussions will cover market survey and trends, development plans and roadmaps as well as investment strategies.

  • Coordinator: J. Jaffe, The Daily Deal, London, United Kingdom
  • Panelists:
    • Analysts
      • B. Malhame, New Jersey, USA, SG Cowen, Paris, France
      • M. Bourne, Cahners-In Stat, Scottsdale, USA
    • Executives
      • J. Christiansen, CEO SensoNor, Oslo, Norway
      • J-M. Karam, CEO MEMScAP, Saint Ismier, France
      • I-L. Cheng, President, Walsin Lihwa Corporation, Taipei, Taiwan
      • A. Lotfi, Enpirion, CTO, Murray Hill, USA

18.20-19.45 Posters Viewing - II / Exhibition

20.00-22.33 Banquet

Wednesday 8 May


8.30-9.10 Invited talk 4: "Microfabrication of modular MEMS - assembly and reliability"
V. Grosser, Fraunhofer IZM Berlin, Germany
Chair: B. Michel, Fraunhofer IZM Berlin, Germany

9.10-9.50 Invited talk 5: "In-situ Sensors for Product Reliability Monitoring"
M. Pecht, CALCE Electronic Products and Systems Center, USA & University of Maryland, USA
Chair: B. Michel, Fraunhofer IZM Berlin, Germany

9.50-10.20 Break

10.20-12.20
Session 7: Methods, tools and design flows
Chair: R. Laur,
University of Bremen, Germany
Session 8: Characterization and reliability
Chair: E.H.F. Tay,
National University of Singapore
Generation of MEMS component models using Cosserat symbolic simulations
R. Rosing, C. Wang, R. Tucker, A. Richardson, Lancaster University, United Kingdom
B. De Masi, STMicroelectronics, Milano, Italy
Damage mechanical material characterization and structural finite element analysis of polymer encapsulation materials
M. Sonner, P. Sprafke, Robert Bosch GmbH, Stuttgart, Germany
B. Michel, Fraunhofer IZM, Berlin, Germany
Modeling optoelectronic devices for simulation by means of element stamps
G. Casinovi, Georgia Institute of Technology, Atlanta, USA
A 2f method for the precise measurement of resonant frequency and Q-factor of micromechanical transducers
V.J. Logeeswaran, M.L. Chan, E.H.F. Tay, F.S. Chau, Y.C. Liang, National University of Singapore, Singapore
Standardizing the microsystems technology description
K. Liateni, G. Thomas, C.H.B. Hoa, D. Bensaude, MEMScAP, Saint-Ismier, France
Characteristics of torsional resonator with two degrees of freedom fabricated by UV-LIGA
T. Usuda, National Metrology Institute, Ibaraki, Japan
S. Basrour, TIMA Laboratory, Grenoble, France
H. Majjad, J-R. Coudevylle, M. de Labachellerie, LPMO, Besançon France
Behavioural modelling and simulation of a MEMS-based ultrasonic pulse-echo system
L. Rufer, C. Domingues, S. Mir, TIMA Laboratory, Grenoble, France
Study of adhesive forces on a silicon tip by atomic force microscope in contact mode
V. Agache, B. Legrand, L. Buchaillot, IEMN, Villeneuve dÕAscq, France
D. Collard, The University of Tokyo, Japan
An application of XML to geometric modeling of MEMS
J-H. Lee, C-W. Cheng, National Center for High-Performance Computing, Hsinchu, Taiwan
H-C. Wu, National Central University, Taoyuan, Taiwan
W-T. Lee, National Chiao Tung University, Hsinchu, Taiwan
Strength and reliability testing of wafer-bonded MEMS
J. Bagdahn, D. Katzer, M. Petzold, Fraunhofer-Institute for Mechanics of Materials, Halle, Germany
M. Wiemer, Fraunhofer-Institute for Reliability and Microintegration, Chemnitz, Germany
Integrated eectromechanical, microelectronic, and optical design tolls for optoelectronic and RF high speed communication devices
A. Przekwas, M. Turowski, Z. Sikorski, Y. Jiang, H.Q. Yang, R. Trammel, A. Hieke, CFD Research Corp., Huntsville, USA
Environmental test bench for reliability studies: Influence of temperature on RF switches with metallic membranes
X. Lafontan, Ch. Le-Touze, B. Wenk, I. Kolesnik, MEMScAP, Saint-Ismier, France
F. Pressecq, G. Perez, J-M. Nicot, M. Dardhalon, S. Rigo, CNES, Toulouse, France

12.30 Lunch

14.00-15.40
Session 9: Component design
Chair: M. Ismail,
Ohio State University, Columbus, USA
Session 10: Integrated process and manufacturing
Chair: D. Tolfree,
DRAL, Warrington, UK
Design and fabrication of a novel low cost hotplate micro gas sensor
J. Wöllenstein, J. Hildenbrand, G.Kühner, H. Böttner, Fraunhofer Institute of Physical Measurement Techniques, Freiburg, Germany
E. Spiller, G. Urban, J.G. Korvink, University of Freiburg, Germany
Fully CMOS compatible low-power microheater
J. Laconte, C. Dupont, A. Akheyar, J-P. Raskin, D. Flandre, Université Catholique de Louvain, Louvain-la-Neuve, Belgium
Design of electrostatic actuators for MOEMS applications
D. Hah, M.C. Wu, University of California, Los Angeles, USA
H. Toshiyoshi, University of Tokyo, Japan
Silicon as material for mechanical wristwatches
A. Perret, A. Hoogerwerf, Ph. Niedermann, X-M. Tang, CSEM, Neuchâtel, Switzerland
S. Jeanneret, P-A. Clerc, N.F. de Rooij, IMT, Neuchâtel, Switzerland
P. Gygax, Ulysse Nardin SA, Le Locle, Switzerland
On-chip synchronous detection for CMOS BDJ optical detector
G.N. Lu, G. Carrillo, A. El Mourabit, LENAC, Villeurbanne, France
G. Sou, University of Pierre & Marie Curie, Paris VI, France
A. Aubert, CEGELY, Villeurbanne, France
Double sided bulk micromachining of SOI films using room temperature oxygen plasma assisted bonding
A. Sanz-Velasco, Chalmers University of Technology, Göteborg, Sweden
H. Rödjegård, G.I. Andersson, The IMEGO Institute, Göteborg, Sweden
High Q MEMS oscillator
P. Neuzil, V. Samper, Institute of Microelectronics, Singapore
B. Ilic, Cornell University, Ithaca, USA
High-Q RF passives on organic substrates using a low-cost low-temperature laminate process
S. Dalmia, S. H. Lee, S. Bhattacharya, F. Ayazi, M. Swaminathan, Georgia Institute of Technology, Atlanta, USA
Digital compensation technique for the improvement of the comb drive actuator transient response
M.S. Mahmoud, M.T. El-Hagry, ERI, Cairo,Egypt
D. Khalil, Ain Shams University/MEMScAP, Cairo, Egypt
M.A. Badr, Ain Shams University, Cairo, Egypt
Hot embossing of microstructures with integrated conduction paths for the production of lab-on-chip systems
M. Heckele, F. Anna, Institut für M.F. Karlsruhe, Germany

15.40-16.30 Coffee / Exhibition


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