Microfabrication, Integration and Packaging Conference

Aim of the Conference

This Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary invited talks

Conference Chair: B. MICHEL, Fraunhofer IZM, Berlin, Germany

Conference Co-Chair: J. WALKER, Tellium Inc., Oceanport, USA

Programme Committee

V. BRIGHT, University of Colorado, Boulder, USA
H. FUJITA, University of Tokyo, Japan
K. SATO, Nagoya University, Japan
R. MAEDA, MITI, Tsukuba, Japan
D. ALLEN, Cranfield University, Bedford, United Kingdom
F. TAY, National University of Singapore
D. TOLFREE, DRAL, Warrington, UK
J. FORD, OMM, San Diego, USA
A. TAY, National University of Singapore
G.S. KUO, National Chengchi University, Taipei, Taiwan
A.Q. LIU, Nayang Technological University, Singapore
H. THIENPONT, Vrije Universiteit Brussel, Belgium
S. WALKER, IMMI, Monrovia, USA
K. BERGMAN, Tellium Inc., Oceanport, USA
M. de LABACHELERIE, LPMO, Besançon, France
C. KHAN MALEK, LSAI, Paris, France
J. JAKUBCZAK, Sandia National Labs, Albuquerque, USA
D. SEEGER, IBM, Watson Res. Center, Yorktown Heights, USA
V. KEMPE, AMS, Unterpremstatten, Austria
N. McDONALD, University of California, Santa Barbara, USA
M. HECKELE, Institut fuer M.F. Karlsruhe, Germany
W. MENZ, University Freiburg, Germany
J. DUAL, ETH Zurich, Switzerland
K. KISHIMOTO, Tokyo Institute of Technology, Japan
T. GEORGE, Jet Propulsion Laboratory, Pasadena, USA

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