Invited talk 1: POWER AND INTEGRATED MICROSYSTEMS
Khalil Najafi, University of Michigan, USA
This talk will discuss recent developments and future trends in micro power generation and scavenging, design of low-power sensors, actuators and MEMS, design of low-power interface circuits and system architectures, and development of MEMS-based low-power wireless communication links for wireless integrated microsystems (WIMS).
Invited talk 2: MICROOPTICAL PHASED ARRAYS FOR SPATIAL AND SPECTRAL SWITCHING
Olav Solgaard, Stanford University, USA
MEMS technology enables the creation of large arrays of microreflectors that can be actuated with high precision at high speed. In this talk we explore the use of this technology for optical switching in both the spatial and spectral domain.
Invited talk 3: THE "MILLIPEDE" - MORE THAN 1000 TIPS FOR A M(N)EMS BASED SCANNING-PROBE DATA STORAGE
Peter Vettiger, IBM Research Division, Zurich Research Laboratory, Rueschlikon, Switzerland
A new atomic force microscope (AFM)-based data storage concept called the "Millipede" will be presented. The M(N)EMS makes use of a large 2D (32x32) array chip of integrated cantilevers/tips to be operated in parallel, achieving storage densities of 100-200Gb/in2 and potentially even more. A micromachined silicon X/Y/Z scanner complements the M(N)EMS storage device which has a potential for ultrahigh density, terabit capacity, small form factor, and low power consumption matching the data storage requirements for future mobile devices.
Invited talk 4: MICROFABRICATION OF MODULAR MEMS - ASSEMBLY AND RELIABILITY
Volker Grosser, Fraunhofer IZM Berlin, Germany
The paper presents a German research program for the development of an industrial framework in the fields of mechanical engineering, chemistry and sensor systems. The modular MEMS strategy has been developed to strengthen the manufacturing of microsystems mainly for small and medium quantities. Special attention is given to the aspect of MEMS packaging and assembly.
Invited talk 5: IN-SITU SENSORS FOR PRODUCT RELIABILITY MONITORING
Michael Pecht, CALCE Electronic Products and Systems Center, USA & University of Maryland, USA
This talk presents a sensor technology approach to evaluate semiconductor device reliability in-situ within the product life cycle. The goal is to provide advance warning of failure.
Copyright© 2002 Laboratoire TIMA.
Tous droits réservés.