6-8 May 2002-Cannes-Mandelieu, "Côte d'Azur", France
Chair: Bernard COURTOIS, TIMA, France
Co-Chair: Karen MARKUS, JDS Uniphase, USA

Conferences Invitation to participate

CAD, Design and Test

Chair: T. MUKHERJEE, Carnegie Mellon University, Pittsburgh, USA

Co-Chair: J.M. KARAM, MEMScAP Grenoble, France

Microfabrication, Integration and Packaging

Chair: B. MICHEL, IZM, Berlin, Germany

Co-Chair: J. WALKER, Tellium Inc., Oceanport, USA

This Symposium will be a follow-up to the very successful issues held in 1999 and 2000 in PARIS and in 2001 in Cannes-Mandelieu. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices and systems.

We look forward to welcoming you to Mandelieu and encourage you to participate by submitting an abstract for one of the two Conferences.

K. MARKUS, JDS Uniphase


Workshop on MEMS/MOEMS business development: CEOs/analysts panel
Workshop on CAD needs for MEMS organized by NEXUS

CAD, Design and Test Microfabrication, Integration
and Packaging
Conference Chair: T. MUKHERJEE,
Carnegie Mellon University, Pittsburgh, USA

Conference Co-Chair: J.M. KARAM,
MEMScAP Grenoble, France

Programme Committee

S. BLANTON, Carnegie Mellon Univ., Pittsburgh, USA
M. RENCZ, BUTE, Budapest, Hungary
Y.C. LIANG, National Univ. of Singapore
R. RUDD, Lawrence Livermore National Lab., USA
R. LAUR, Univ. Bremen, Germany
G. WACHUTKA, TU München, Germany
M. ISMAIL, Ohio State Univ., Columbus, USA
S. LEVITAN, Univ. of Pittsburgh, USA
C. CANE, Univ. of Barcelona, Spain
J. KORVINK, Univ. of Freiburg, Germany
I. BALK, IntelliSense Corp., Wilmington, USA
B. VIGNA, STMicroelectronics, Cornadero, Italy
M.A. MAHER, MEMScAP Inc., Raleigh, USA
F. MALOBERTI, Texas A&M Univ., College Station, USA
J. Van KUIJK, Coventor, Cambridge, USA
T. VEIJOLA, Helsinki Univ. of Technology, Finland
C. DUFAZA, LIRMM, Montpellier, France
A. KAISER, IEMN, Lille, France

This Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS.
The participants will also have the opportunity to interact with the other Conference by the means of plenary talks.

The topics for this Conference include:

  • Technology CAD in general
  • Modeling and simulation of fabrication processes
  • Devices and components (sensors, actuators, ...)
  • MEMS/MOEMS libraries and IP
  • Signal processing
  • Integrated CAD tools
  • Numerical simulation
  • Yield estimation
  • Failure mechanisms
  • Fault modeling
  • Fault simulation and test pattern generation
  • Thermal evaluation
  • Interoperability of CAD/CAE tools
  • Multidomain simulation
  • Structured design methodologies
  • Languages for interchange data among designs and tools
Conference Chair: B. MICHEL,
IZM, Berlin, Germany

Conference Co-Chair: J. WALKER,
Tellium Inc., Oceanport, USA

Programme Committee

V. BRIGHT, Univ. of Colorado, Boulder, USA
H. FUJITA, Univ. of Tokyo, Japan
K. SATO, Nagoya Univ., Japan
R. MAEDA, MITI, Tsukuba, Japan
D. ALLEN, Cranfield Univ., Bedford, UK
F. TAY, National Univ. of Singapore
D. TOLFREE, DRAL, Warrington, UK
J. FORD, OMM, San Diego, USA
A. TAY, National Univ. of Singapore
G.S. KUO, National Chengchi Univ., Taipei, Taiwan
A.Q. LIU, Nayang Technological Univ., Singapore
H. THIENPONT, Vrije Univ., Brussel, Belgium
S. WALKER, IMMI, Monrovia, USA
K. BERGMAN, Tellium Inc., Oceanport, USA
M. HECKELE, Institut fuer M. F. Karlsruhe, Germany
K. KISHIMOTO, Tokyo Institute of Technology, Japan
V. KEMPE, AMS, Unterpremstatten, Austria
W. MENZ, Univ. of Freiburg, Germany
J. DUAL, ETH Zurich, Switzerland
M. de LABACHELERIE, LPMO, Besançon, France
C. KHAN MALEK, LSAI, Paris, France
D. SEEGER, IBM, Watson Research Center, Yorktown Heights, USA
N. McDONALD, Univ. of California, Santa Barbara, USA
J. JAKUBCZAK, Sandia Nat. Labs, Albuquerque, USA
T. GEORGE, Space Microsensors Section, Pasadena, USA

This Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks.

The topics for this Conference include:

  • Integrated processes (micromachining, micromolding, ...)
  • Microlithography issues unique to MEMS/MOEMS
  • Manufacturing
  • Materials
  • Assembly technologies
  • Packaging for harsh environments
  • MOEMS packaging
  • RF and microwave packaging
  • Test structures
  • Devices & components (sensors, actuators...)
  • Dimensional measurements
  • Physical measurements
  • Failure analysis
  • Reliability
  • Characterization
  • Process monitoring

Plenary invited talks

Very prominent speakers will be invited to give plenary talks.

Workshop on MEMS/MOEMS business development

A Workshop on MEMS/MOEMS business development will be organized in the framework of the Symposium. The industry of MEMS/MOEMS is developing as a specific industrial area, with its own suppliers of components, with manufacturers of equipment for the fabs, with CAD tool vendors, ...etc.

This year, the Workshop will put together CEOs of major companies and analysts. The format of the Workshop will consist in short presentations and a panel.

Workshop on CAD needs for MEMS

A Workshop on CAD needs for MEMS will be organized in the framework of the Symposium under the auspices of the NEXUS User Supplier Club (USC) on CAD.

The Workshop will enable a lively interaction between users and suppliers of MEMS design tools, it will make users of CAD tools aware of the availability of new tools, it will discuss interfaces between tools, it will discuss the development of a CAD for MEMS roadmap, ...etc. The Workshop will be chaired by P. SALOMON, co-ordinator of the NEXUS USC "CAD tools for MEMS".

Tel.: +33 476 574 615
Fax: +33 476 473 814
JDS Uniphase
Tel.: +1 919 314 2300
Fax: +1 919 314 2201
Carnegie Mellon University
Tel.: +1 412 268 8522
Fax: +1 412 268 6662
Tel.: +33 476 525 580
Fax: +33 476 525 581
Tel.: +49 304 6403 200
Fax: +49 30 46403 211
Tellium Inc.
Tel.: +1 732 483 2975
Fax: +1 732 728 9862


An exhibition will be organized in the framework of the Symposium.
CAD software, products, equipments, instruments, foundries offerings, ...etc, may be exhibited. Exhibitors who will register early enough will be given the opportunity to give a product presentation during the vendor session that will be placed in the Symposium programme.
If you plan to exhibit, please contact the Symposium Chair.

Specific Events Sponsoring

If you wish to sponsor an event like a reception, a lunch, or any specific event during the Symposium, please contact the Symposium Chair.


The Symposium will be held at the Sofitel Royal Casino in Cannes-Mandelieu. The Sofitel Royal Casino is located between the Estérel and La Croisette, on one the most beautiful bay in the world. Cannes' combination of assets makes each event exceptional. Its sunny climate the whole year round, the richness of its landscapes, its modern infrastructure and its ease of access from the biggest cities of the world enable Cannes to be the choice destination of DTIP 2002.
Cannes-Mandelieu is served by the International Nice-Côte d'Azur airport and by the airport of Cannes-Mandelieu (2km), by train, railway stations, Cannes or La Napoule, by car, Motorway A8 exit 40.

Preferential rates are offered to the participants. The hotel reservation form is available. The first bookings will get priority on the sea view rooms.

Paper Review

To ensure a high-quality conference, all abstracts and Proceedings papers will be reviewed by the Conference Chairs for technical merit and content.

Oral or Poster Presentation

Submitted papers may be selected for oral or poster presentation. All oral and poster presentations will be included in the Symposium Proceedings.

Submission of Abstracts

Your abstract must include the following:

  • the conference you submit to (only one Conference, either CAD, Design and Test, or Microfabrication, Integration and Packaging).


  • AUTHOR LISTING (principal author first)
    First (given) name, Last (family) name, and affiliations, mailing address, telephone, fax and e-mail address.

    Indicate your preference for "Oral Presentation" or "Poster Presentation".
    Placement is subject to chair's discretion.

    Not less than 250 words, preferably 1500 words.

    List a maximum of five key words.

  • BRIEF BIOGRAPHY (of principal author)
    Approximately 50 words.

Submission will be electronically only.

Prospective authors should prepare an extended summary or the full paper to be submitted as PDF file. Uncompressed unencapsulated postscript may also be used when necessary. Use the contact author's last name as file name; add numerals in the case of multiple submissions (e.g., lo1, lo2). Detailed information about the submission process will be made available on the Symposium Web page.

Authors should notify their submission to the Chair Bernard COURTOIS by email.

Conditions of Acceptance

Authors are expected to secure registration fees and travel and accommodation funding, through their sponsoring organizations, before submitting abstracts.
Only original material should be submitted.
Abstracts should contain enough detail to clearly convey the approach and the results of the research.
Government and company clearance to present and publish should be final at the time of submittal.
Commercial papers with no research, presenting products, cannot be submitted to the Symposium. Such papers can be presented in the framework of the exhibition (see corresponding section).


The proceedings of the Symposium will be published by SPIE, the International Society for Optical Engineering. Proceedings published by SPIE are abstracted by INSPEC, Compendex, Current Contents, Chemical Abstract Service, Astrophysics Data System, International Aerospace Abstracts and several others. The Proceedings of the Symposium will be available at the meeting.

Copyright © 2002 Laboratoire TIMA.
Tous droits réservés.