|6-8 May 2002-Cannes-Mandelieu, "Côte d'Azur", France|
Chair: Bernard COURTOIS, TIMA, France |
Co-Chair: Karen MARKUS, JDS Uniphase, USA
|Conferences||Invitation to participate|
CAD, Design and Test Chair: T. MUKHERJEE, Carnegie Mellon University, Pittsburgh, USA
Co-Chair: J.M. KARAM, MEMScAP Grenoble, France
Microfabrication, Integration and Packaging Chair: B. MICHEL, IZM, Berlin, Germany
Co-Chair: J. WALKER, Tellium Inc., Oceanport, USA
This Symposium will be a follow-up to the very successful issues held in 1999 and 2000 in PARIS and in 2001 in Cannes-Mandelieu. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices and systems.
We look forward to welcoming you to Mandelieu and encourage you to participate by submitting an abstract for one of the two Conferences.
B. COURTOIS, TIMA
Workshop on MEMS/MOEMS business development: CEOs/analysts panel
|CAD, Design and Test||Microfabrication, Integration|
Conference Chair: T. MUKHERJEE, |
Carnegie Mellon University, Pittsburgh, USA
Conference Co-Chair: J.M. KARAM, Programme Committee
M. RENCZ, BUTE, Budapest, Hungary
Y.C. LIANG, National Univ. of Singapore
R. RUDD, Lawrence Livermore National Lab., USA
R. LAUR, Univ. Bremen, Germany
G. WACHUTKA, TU München, Germany
M. ISMAIL, Ohio State Univ., Columbus, USA
Z. CUI, RAL, UK
S. LEVITAN, Univ. of Pittsburgh, USA
C. CANE, Univ. of Barcelona, Spain
J. KORVINK, Univ. of Freiburg, Germany
I. BALK, IntelliSense Corp., Wilmington, USA
B. VIGNA, STMicroelectronics, Cornadero, Italy
M.A. MAHER, MEMScAP Inc., Raleigh, USA
F. MALOBERTI, Texas A&M Univ., College Station, USA
J. Van KUIJK, Coventor, Cambridge, USA
T. VEIJOLA, Helsinki Univ. of Technology, Finland
C. DUFAZA, LIRMM, Montpellier, France
A. PRZEKWAS, CFDRC, Huntsville, USA
A. KAISER, IEMN, Lille, France
This Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS.
The topics for this Conference include:
Conference Chair: B. MICHEL, |
IZM, Berlin, Germany
Conference Co-Chair: J. WALKER, Programme Committee
H. FUJITA, Univ. of Tokyo, Japan
K. SATO, Nagoya Univ., Japan
R. MAEDA, MITI, Tsukuba, Japan
P. VIKTOROVITCH, LEOM, Ecully, France
D. ALLEN, Cranfield Univ., Bedford, UK
F. TAY, National Univ. of Singapore
D. TOLFREE, DRAL, Warrington, UK
J. FORD, OMM, San Diego, USA
A. TAY, National Univ. of Singapore
G.S. KUO, National Chengchi Univ., Taipei, Taiwan
A.Q. LIU, Nayang Technological Univ., Singapore
H. THIENPONT, Vrije Univ., Brussel, Belgium
S. WALKER, IMMI, Monrovia, USA
K. BERGMAN, Tellium Inc., Oceanport, USA
M. HECKELE, Institut fuer M. F. Karlsruhe, Germany
K. KISHIMOTO, Tokyo Institute of Technology, Japan
V. KEMPE, AMS, Unterpremstatten, Austria
W. MENZ, Univ. of Freiburg, Germany
J. DUAL, ETH Zurich, Switzerland
M. de LABACHELERIE, LPMO, Besançon, France
C. KHAN MALEK, LSAI, Paris, France
D. SEEGER, IBM, Watson Research Center, Yorktown Heights, USA
N. McDONALD, Univ. of California, Santa Barbara, USA
J. JAKUBCZAK, Sandia Nat. Labs, Albuquerque, USA
T. GEORGE, Space Microsensors Section, Pasadena, USA
This Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks.
The topics for this Conference include:
Plenary invited talksVery prominent speakers will be invited to give plenary talks.
Workshop on MEMS/MOEMS business development
A Workshop on MEMS/MOEMS business development will be organized in the framework of the Symposium. The industry of MEMS/MOEMS is developing as a specific industrial area, with its own suppliers of components, with manufacturers of equipment for the fabs, with CAD tool vendors, ...etc.
This year, the Workshop will put together CEOs of major companies and analysts. The format of the Workshop will consist in short presentations and a panel.
Workshop on CAD needs for MEMS
A Workshop on CAD needs for MEMS will be organized in the framework of the Symposium under the auspices of the NEXUS User Supplier Club (USC) on CAD.
The Workshop will enable a lively interaction between users and suppliers of MEMS design tools, it will make users of CAD tools aware of the availability of new tools, it will discuss interfaces between tools, it will discuss the development of a CAD for MEMS roadmap, ...etc. The Workshop will be chaired by P. SALOMON, co-ordinator of the NEXUS USC "CAD tools for MEMS".
|B. COURTOIS |
Tel.: +33 476 574 615
Fax: +33 476 473 814
Tel.: +1 919 314 2300
Fax: +1 919 314 2201
|T. MUKHERJEE |
Carnegie Mellon University
Tel.: +1 412 268 8522
Fax: +1 412 268 6662
Tel.: +33 476 525 580
Fax: +33 476 525 581
|B. MICHEL |
Tel.: +49 304 6403 200
Fax: +49 30 46403 211
Tel.: +1 732 483 2975
Fax: +1 732 728 9862
An exhibition will be organized in the framework of the Symposium.
Specific Events Sponsoring
If you wish to sponsor an event like a reception, a lunch, or any specific event during the Symposium, please contact the Symposium Chair.
The Symposium will be held at the Sofitel Royal Casino in Cannes-Mandelieu. The Sofitel Royal Casino is located between the Estérel and La Croisette, on one the most beautiful bay in the world. Cannes' combination of assets makes each event exceptional. Its sunny climate the whole year round, the richness of its landscapes, its modern infrastructure and its ease of access from the biggest cities of the world enable Cannes to be the choice destination of DTIP 2002.
Preferential rates are offered to the participants. The hotel reservation form is available. The first bookings will get priority on the sea view rooms.
Paper ReviewTo ensure a high-quality conference, all abstracts and Proceedings papers will be reviewed by the Conference Chairs for technical merit and content.
Oral or Poster PresentationSubmitted papers may be selected for oral or poster presentation. All oral and poster presentations will be included in the Symposium Proceedings.
Submission of AbstractsYour abstract must include the following:
Submission will be electronically only.
Prospective authors should prepare an extended summary or the full paper to be submitted as PDF file. Uncompressed unencapsulated postscript may also be used when necessary. Use the contact author's last name as file name; add numerals in the case of multiple submissions (e.g., lo1, lo2). Detailed information about the submission process will be made available on the Symposium Web page.
Authors should notify their submission to the Chair Bernard COURTOIS by email.
Conditions of Acceptance
Authors are expected to secure registration fees and travel and accommodation funding, through their sponsoring organizations, before submitting abstracts.
The proceedings of the Symposium will be published by SPIE, the International Society for Optical Engineering. Proceedings published by SPIE are abstracted by INSPEC, Compendex, Current Contents, Chemical Abstract Service, Astrophysics Data System, International Aerospace Abstracts and several others. The Proceedings of the Symposium will be available at the meeting.
Copyright © 2002 Laboratoire TIMA.
Tous droits réservés.