Aim of the Symposium

This Symposium will be a follow-up to the very successful issues held in 1999 and 2000 in PARIS and in 2001 in Cannes Mandelieu. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems. This year, the Symposium has received much more submissions than previously: 66 submissions to the CAD, Design and Test Conference, and 61 submissions to the Microfabrication, Integration and Packaging Conference. This is about a 50% increase compared to 2001.

The Symposium is sponsored by the IEEE Computer Society Test Technology Technical Council and TIMA Laboratory, in cooperation with the IEEE Components, Packaging and Manufacturing Technology Society, SPIE The International Society for Optical Engineering and the IEEE Circuits and Systems Society in collaboration with the French Chapter.

We look forward to welcoming you to Cannes-Mandelieu.

K. MARKUS, JDS Uniphase