Conferences

CAD, Design and Test

Chair: T. MUKHERJEE,
Carnegie Mellon University, Pittsburgh, USA

Co-Chair: J-M. KARAM,
MEMScAP S.A., Grenoble, France

Microfabrication, Integration
and Packaging

Chair: B. MICHEL,
IZM, Berlin, Germany

Co-Chair: J. WALKER,
Tellium Inc., Oceanport, USA

including

Workshop on MEMS/MOEMS business development: CEOs/analysts panel

and

Workshop on Design Approaches for MEMS organized by NEXUS