Technical Programme

 

Tuesday 9 May
8.30-10.15 Registration
10.15-10.30 Opening
B. Courtois, TIMA, Grenoble, France
10.30-11.10 Invited talk 1: "Microactuated Optical MEMS"
H. Fujita, The Univ. of Tokyo, Japan
Chair: K. Markus, Cronos, Research Triangle Park, USA

Optical scanners and switches are presented as examples of microactuated optical devices. Also a three dimensional chip-level packaging technique that is capable of optical, mechanical and electronic connections is discussed.

11.10-11.50 Invited talk 2: "CAD for Integrated MEMS Design"
T. Mukherjee, Carnegie Mellon Univ., Pittsburgh, USA
Chair: S. Crary, The Univ. of Michigan, USA

The increasing insertion of MEMS sensor capabilities into embedded systems will push integration of digital and analog electronics with MEMS technologies. Design methodologies and tools that blend MEMS design with IC design will be presented.

12.00 Lunch
13.30-15.10
Session 1: Model generation and behavioural simulation
Chair: G. Wachutka, TU München, Germany		 Session 2: Assembly technologies
Chair: S. Valette, LETI, Grenoble, France
AUTOMATED GENERATION OF COMPACT MODELS FOR FLUIDIC MICROSYSTEMS
M. Turowski, Z. Chen, A. Przekwas, CFD Research, Huntsville, USA		 ADVANCED FLIP CHIP TECHNOLOGIES IN RF, MICOWAVE AND MEMS APPLICATIONS
H. Oppermann1, C. Kallmayer2, M. Klein2, R. Aschenbrenner1, H. Reichl1, 1Fraunhofer IZM, Berlin, Germany, 2TU of Berlin, Germany
THERMODEL: A TOOL FOR THERMAL MODEL GENERATION, AND APPLICATION FOR MEMS PACKAGES
V. Székely1, M. Rencz2, A. Poppe2, B. Courtois3, 1TU of Budapest, Hungary, 2MicRed, Budapest, Hungary, 3TIMA, Grenoble, France		 RESIDUAL THERMO-MECHANICAL STRESSES IN A MULTI-LEVEL ULTRA THIN CHIP STACK TECHNOLOGY
J. Puigcorbé1, S. Leseduarte1, S. Marco1, E. Beyne2, R. Van Hoof1, A. Marty3, S. Pinel3, O. Vendier4, A. Coello-Vera4, 1Univ. de Barcelona, Spain, 2IMEC, Leuven, Belgium, 3LAAS, Toulouse, France, 4ALCATEL, Toulouse, France
EFFICIENT REDUCED ORDER MODELING FOR SYSTEM SIMULATION OF MICRO ELECTRO MECHANICAL SYSTEMS (MEMS) FROM FEM MODELS
D. Ostergaard1, M. Gyimesi1, B. Affour2, P. Nachtergaele2, S. Spirkovitch2, 1ANSYS, Canonsburg, USA, 2MEMScAP, Saint-Ismier, France		 A NEW ULTRA-THIN 3D INTEGRATION TECHNIQUE: TECHNOLOGICAL AND THERMAL INVESTIGATIONS
S. Pinel1, J. Tasselli1, A. Marty1, J.-P. Bailbe1, E. Beyne2, R. Van Hoof2, S. Marco3, S. Leseduarte3, O. Vendier4, A. Coello-Vera4, 1LAAS, Toulouse, 2IMEC, Leuven, Belgium, 3Univ. de Barcelona, Spain, 4ALCATEL, Toulouse, France
NUMERICAL SPRING MODELS FOR BEHAVIORAL SIMULATION OF MEMS INERTIAL SENSORS
S. Iyer, T. Mukherjee, Carnegie Mellon Univ., Pittsburgh, USA		 WAFER DIRECT BONDING AT ROOM TEMPERATURE BY SAB METHOD
T. Suga1, H. Takagi2, T.R. Chung1, T. Itoh1, 1The Univ. of Tokyo, Japan, 2Mechanical Eng. Lab., Ibaraki, Japan
DESIGN AND OPTIMIZATION OF PASSIVE COMPONENTS FOR OPTICAL INTERCONNECTS
P. Bontoux, I. O'Connor, F. Gaffiot, G. Jacquemod, LEOM/ECL, Lyon, France		 INTEGRATION AND PACKAGING OF MEMS RELAYS
J. Kim, C. Bolle, R. Boie, J. Gates, A. Ramirez, S. Jin, D.J. Bishop, Bell Laboratories, Murray Hill, USA
15.10-15.40 Break
15.40-17.00
Session 3: Design methods and optimization I
Chair: V. Kempe, AMS, Unterpremstatten, Austria		 Session 4: Devices and components I
Chair: J. Bausells, CNM, Bellaterra, Spain
INCREASING THE DYNAMIC RANGE OF A MICROMECHANICAL MOVING PLATE CAPACITOR
J. Kyynäräinen, A. Oja, H. Seppä, VTT Automation, Espoo, Finland		 A SCREAM MICROMACHINED HIGH ASPECT RATIO LOW-G MICROACCELEROMETER
F.E.H. Tay, V.J. Logeeswaran, Y.C. Liang, NUS, Singapore
NON-LINEAR ANALYSIS OF BEAMS AND PLATES UNDER ELECTROSTATIC LOADS
A. Gugliotta1, A. Somà1, S. Di Mauro1, F. De Bona2, F. Roccaforte2, 1Politecnico di Torino, Italy, 2Univ. di Udine, Italy		 SILICON MICROELECTROMECHANICAL SYSTEMS FOR MILIMETRE-WAVE APPLICATIONS
J.-K. Grenier, P. Pons, T. Parra, R. Plana, J. Graffeil, LAAS, Toulouse, France
HIGH THERMAL IMPEDANCE BEAMS FOR SUSPENDED MEMS
S. Mir, B. Charlot, F. Parrain, D. Veychard, TIMA, Grenoble, France		 MICROMECHANIC SENSORS FOR VERY SMALL FLOWS AND CHEMICAL QUANTITIES INTEGRATED IN A PRECISION MADE STANDARD HOUSING - EXAMPLES OF A WELL WORKING TECHNOLOGY MIXTURE
J. Joswig1, G. Urban2, R. Born3, Ph. Arquint4, B. van der Schoot4, A. Campitelli5, 1FV Institut für Medizintechnik e. V., Radebeul, Germany, 2Albert-Ludwigs-Univ. Freiburg, Germany, 3Dornier GmbH, Friedrichshafen, Germany, 4Univ. of Neuchâtel, Switzerland, 5IMEC, Leuven, Belgium
DEVELOPMENT AND APPLICATION OF A COMPUTER-SUPPORTED METHOD FOR DESIGN OPTIMIZATION OF MICROOPTICAL SYSTEMS
I. Sieber, H. Guth, H. Eggert, K.-P. Scherer, Forschungszentrum Karlsruhe, Germany		 DESIGN, FABRICATION AND PACKAGING OF CLOSED CHAMBER PCR-CHIPS FOR DNA AMPLIFICATION
C.G.J. Schabmueller1, A.G.R. Evans1, A. Brunnschweiler1, G.J. Ensell1, D.L. Leslie2, M.A. Lee2, 1Univ. of Southampton, UK, 2DERA, Wiltshire, UK
17.00
Posters introduction:
CAD, Design and Test posters are introduced by one slide in 3 minutes each.
Chair: H.R. Krauß, Robert Bosch GmbH, Reutlingen, Germany		 Posters introduction:
Microfabrication, Integration and Packaging posters are introduced by one slide in 3 minutes each.
Chair: M. de Labachelerie, LPMO, Besançon, France
18.00-19.00 Cocktail / posters viewing / exhibition

 

Wednesday 10 May
8.30-9.10 Invited talk 3: "Compliant MEMS: Design Methods and Applications"
S. Kota, Univ. of Michigan, USA
Chair: A. Wild, Motorola, Tempe, USA

A systematic method of synthesis of monolithic mechanical structures called compliant mechanisms is presented. Sophisticated mechanical functions can be realized with these mechanisms and their unitized construction eliminates joint friction, clearances and the need for assembly.

9.10-10.10 Vendors session
Chair: H. Bohlmann, IVAM, Dortmund, Germany
Those exhibitors who have booked a stand at the time of printing the programme will introduce their products in a 8 minute presentation:
CFDRC - MicRed - MICROCOSM - CMP - ALCATEL - MEMScAP - JOBIN YVON.
10.10-10.40 Break
10.40-12.00
Session 5: Design methods and optimization II
Chair: S. Levitan, Univ. of Pittsburgh, USA		 Session 6: Devices and components II
Chair: J. Sohn, Draper Lab., Cambridge, USA
ACOUSTIC AND MAGNETIC MEMS COMPONENTS FOR A HEARING-AID INSTRUMENT
S. Chowdhury1, G.A. Jullien1, M.A. Ahmadi1, W.C. Miller1, D. Keating2, N. Finch2, 1Univ. of Windsor, Canada, 2IntelliSense, Wilmington, MA, USA		 SCANNING MICROMECHANICAL MIRROR FOR FINE-POINTING UNITS OF INTERSATELLITE OPTICAL LINKS
J. Graeffe, M. Suhonen, H. Sipola, T. Sillanpää, VTT Automation, Espoo, Finland
MATHEMATICAL MODELLING ON THE QUADRATURE ERROR OF LOW-RATE MICROGYROSCOPE FOR AEROSPACE APPLICATIONS
B.Y. Yeh, Y.C. Liang, F.E.H. Tay, NUS, Singapore		 PACKAGED BULK MICROMACHINED RESONANT FORCE SENSOR FOR HIGH TEMPERATURE APPLICATIONS
M. Haueis1, J. Dual1, C. Cavalloni2, M. Gnielka2, R. Buser1, 1ETH Zürich, Switzerland, 2Kistler Instrumente AG, Wintherthur, Switzerland
DESIGN OF AN APS CMOS IMAGE SENSOR FOR SPACE APPLICATIONS USING STANDARD CAD TOOLS AND CMOS TECHNOLOGY
J. Goy1, B. Courtois1, J.-M. Karam2, F. Pressecq3, 1TIMA, Grenoble, France, 2MEMScAP, Saint-Ismier, France, 3CNES, Toulouse, France		 DESIGN AND FABRICATION OF A NOVEL THERMALLY ACTUATED VERTICAL BIMORPH SCANNER FOR AN INTEGRATED AFM
H. Sehr, G.R. Evans, A. Brunnschweiler, G.J. Ensell, Univ. of Southampton, UK
ELECTROMAGNETIC ANALYSIS OF THE IR SENSOR FOCAL-PLANE-ARRAYS OF MICRO-OPTICS
Z. Sikorski, Military Univ. of Technology, Warsaw, Poland		 MICROMACHINED CMOS MAGNETIC FIELD SENSORWITH FERRO-MAGNETIC ACTUATION
L. Latorre1, V. Beroulle1, Y. Bertrand1, P. Nouet1, I. Salesse2, 1LIRMM, Montpellier, France, 2ATEMI, Montpellier, France
12.00-12.40 Posters viewing / exhibition
12.40 Lunch
14.10-15.10
Session 7: Electronics for MEMS
Chair: F. Baillieu, ESIEE, Paris, France		 Session 8: MOEMS packaging
Chair: P. Viktorovitch, LEOM, Ecully, France
SIGNAL-PROCESSING ELECTRONICS FOR A CAPACITIVE MICRO-SENSOR
G. Amendola1, G.N. Lu2, 1ESIEE, Noisy-Le-Grand, France, 2Univ. Lyon 2, Villeurbanne, France		 DILUTE 3-D INTERCONNECT USING PLANAR-INTEGRATED FREE-SPACE OPTICS
C. Gimkiewics, D. Hagedorn, J. Jahns, Fernuniv. Hagen, Germany
MODELLING, DESIGN AND TEST OF A MONOLITHIC INTEGRATED MAGNETIC SENSOR IN A DIGITAL CMOS TECHNOLOGY USING A SWITCHED CURRENT INTERFACE SYSTEM
C. Rubio, S. Bota, J.G. Macias, J. Samitier, Univ. de Barcelona, Spain		 PHOTOVOLTAIC MINIARRAYS ASSEMBLED USING MULTICHIP MODULE TECHNOLOGY (MCM)
P.R. Ortega, L. Castañer, UPC, Barcelona, Spain
VCO DESIGN FOR WIRELESS APPLICATION USING MEMS TECHNOLOGY
A. Mohamed, H. Elsimary, M. Ismail, Ohio State Univ., Columbus, USA		 THERMAL VIAS ON GLASS FOR PLANAR OPTICAL INTERCONNECTION SYSTEMS
C. Gimkiewicz, D. Hagedorn, Optische Nachrichtentechnik, Hagen, Germany
15.10-15.30 Break
15.30-18.00 Workshop on MEMS / MOEMS Business Development
Market research leaves no doubt that the future for MEMS technology is promising. In many applications, MEMS serves as an enabling technology for implementing the required system functions in a compact, economical package. Until recently, the primary market segments were in automotive electronics, medical devices, industrial process, and computer peripherals. Recent advances in MEMS technology combined with explosive demand in telecommunications and consumer electronics have created several new multi-billion dollar market opportunities in wireless communications, optical communications and consumer.

The Workshop will put together various participants from financial investing companies, start-ups as well as long-term sustained organizations. Start-up stories, from the idea, to initial public offering and long-term corporate success will be reviewed. The financial process and sources of such organizations will be deeply discussed.

The format of the Workshop will consist in short presentations followed by discussions with the audience.

Moderator: J. Borel, STMicroelectronics, Crolles, France

Panelists:

19.30-23.46 Parisian evening: Lido
A social event has been organized at Lido de PARIS, the world most famous cabaret. The event will include dinner and dancing and a cabaret show. Participation in the social evening is included in the registration fee. Additional tickets for companions may be purchased through the registration form. Additional tickets will be available at the registration desk on 9 May, upon availability. More details available from F. SANTAMARIA.

HISTORY OF THE LIDO:
In 1946 the Clerico brothers took over an establishment which had been all the rage during the Belle Epoque. Its decoration was directly inspired by the great beach of the Lido in Venice. The Clericos completely overhauled the building, making it into a cabaret, which was unique in the world. With the help first of Pierre Louis Guerin, then Rene Fraday and Miss Bluebell, the Lido literally invented the notion of the dinner-show as we have come to know it throughout the world. One show was to replace another, the latest always more spectacular than its predecessor, and each met with triumphant success. The world's most beautiful avenue still remembers the opening nights when the Lido received all of the international society. Its uninterrupted success lead the cabaret to seek larger quarters. In 1977, the Lido was moved to the Normandy building, whose 60,000 square feet allowed for the creation of a 1,100 seat panoramic theatre offering perfect visibility to each visitor. At that time, Christian Clerico took over from his father Joseph, and has since managed France's greatest private theatre.

All of the MAGIC of the year 2000:
The most famous night-club in the world owes its reputation, in part, to the fact that it has always employed the most advanced technologies available. In keeping with this tradition, for the 25th review, C'EST MAGIQUE!, the technical means used go far beyond anything that had been seen up to now. Stage equipment, lighting, sound and the latest generation in special effects in its newly redecorated theatre by Yves Valente... the Lido has scanned the globe to find the latest in stage techniques for its review. The Lido de Paris a feast for the eye and a delight for the palate.

 

Thursday 11 May
9.00-9.40 Invited talk 4: "Coupling of Length Scales in MEMS Modeling: the atomic limit of finite elements"
R. Rudd, Univ. of Oxford, UK
Chair: J.-M. Karam, MEMScAP, Saint-Ismier, France

Multiscale simulations of sub-micron MEMS are discussed, especially micro-resonators. The methodology employs an atomistic description of the key regions of the device, consisting of millions of atoms, coupled concurrently to a finite element model of the periphery.

9.40-10.00 Break
10.00-10.30
Special session on cooperative R&D
Chair: T. Skordas, Commission of the European Communities		 Special session on cooperative R&D
Chair: D. Beernaert, Commission of the European Communities
TALENT: DESIGN SYSTEMS TO ENABLE ACCESS TO EUROPEAN FOUNDRIES
Speaker: M.-A. Maher, MEMScAP Inc., Raleigh, USA
R. Hamza1, C. Vaganay2, B. Courtois3, Z. Juneidi3, M. Rencz4, G. Kelly5, H.-R. Krauß6, M. Fehrenbach6, V. Dalsrud7, G. Schropfer7, M. Brandl8, 1MEMScAP, Saint-Ismier, France, 2ANACAD, Meylan, France, 3TIMA, Grenoble, France, 4TU of Budapest, Hungary, 5NMRC, Cork, Ireland, 6Robert Bosch GmbH, Reutlingen, Germany, 7SENSONOR, Horten, Norway, 8AMS, Unterpremstatten, Austria 		Si-GYRO: SILICON SURFACE MICROMACHINED GYROSCOPE FOR MASS MARKET APPLICATIONS
Speaker: F. Laermer, Robert Bosch GmbH, Stuttgart, Germany
H. Ashraf1, J. Ramos-Martos2, M. Soininnen3, 1Surface Technology Systems Ltd., Newport, UK, 2Centro Nacional de Microelectronica IMSE, Sevilla, Spain, 3Volvo Car Corporation, Gothenburg, Sweden
10.30-12.10
Session 9: CAD Systems
Chair: M. Rencz, TU of Budapest, Hungary		 Session 10: Integrated process & manufacturing
Chair: F.E.H. Tay, NUS, Singapore
MOVING FROM ANALYSIS TO DESIGN: A MEMS CAD TOOL EVOLUTION
K. Liateni, H.J. Lee, M.-A. Maher, J.-M. Karam, MEMScAP, Saint-Ismier, France		 DEEP PROTON LITHOGRAPHY: RAPID PROTOTYPING OF MICRO-OPTICAL COMPONENTS
P. Tuteleers, C. Debaes, B. Volckaerts, P. Vynck, H. Ottevaere, V. Baukens, A. Hermanne, I. Veretennicoff, H. Thienpont, Vrije Univ. Brussels, Belgium
CFD-MICROMESH: AUTOMATED GEOMETRY AND MESH GENERATION FROM LAYOUTS AND PROCESS FOR 3D MEMS SIMULATIONS
Z.Q. Tan, M. Furmanczyk, M. Turowski, A. Przekwas, CFD Research, Huntsville, USA		 SCHEDULING MEMS FABRICATION
F.E.H. Tay, L.L. Hay, W. Lixin, NUS, Singapore
A ROBUST AND VERSATILE SOFTWARE SYSTEM FOR OPTIMAL DESIGN OF MEMS STRUCTURE
B.M. Kwak, S. Lee, J. Huh, Korea Advanced Inst. of Science and Technology, Taejon, Korea		 PRELIMINARY RESULTS AT THE ULTRA DEEP X-RAY LITHOGRAPHY BEAMLINE AT CAMD
G. Aigeldinger1, 2, P. Coane3, B. Craft1, J. Goettert1, S. Ledger3, Z.G. Ling1, H. Manohara1, L. Rupp1, 1Louisiana State Univ., Baton Rouge, USA, 2Univ. of Freiburg, Germany, 3Louisiana Tech. Univ., Ruston, USA
MIXED-TECHNOLOGY SYSTEM-LEVEL SIMULATION
S.P. Levitan1, J.A. Martinez1, T.P. Kurzweg1, P.J. Marchand2, D.M. Chiarulli1, 1Univ. of Pittsburgh, USA, 2Univ. of California San Diego at La Jolla, USA 		DEVELOPMENT OF A MINIATURE PANTOGRAPH MECHANISM WITH LARGE-DEFLECTIVE HINGES FOR NEW SURFACE MOUNT SYSTEMS
M. Horie, T. Uchida, D. Kamiya, Tokyo Inst. of Technology, Kanagawa, Japan
STANDARDISATION OF MICROSYSTEMS
W. Brenner1, A. Stelmach1, J. Baret2, 1TU of Vienna, Austria, 2INOCON, Attnang-Puchheim, Austria		 RAPID FABRICATION OF MICROCOMPONENTS
T. Hanemann1, J. HauBelt1, R. Ruprecht1, M. Skrifvars2, K.-H. Zum Gahr2, W. Pfleging1, 1Forschungszentrum Karlsruhe, Germany, 2SICOM, Pitea, Sweden
12.10 Lunch
13.40-14.20 Invited talk 5: "Challenges and opportunities in deployment of MEMS for in-vivo monitoring of cardiovascular systems"
R. Mahajan, Univ. of Colorado, Boulder, USA
Chair: A. Tay, National Univ. of Singapore

The talk will focus on the technical challenges that arise in the in-vivo monitoring, detection and treatment of cardiovascular diseases using MEMS. The packaging and wireless telemetry issues will be discussed at length.

14.20-14.40 Break
14.40-16.20
Session 11: Testing & failure analysis
Chair: S. Blanton, Carnegie Mellon Univ., Pittsburgh, USA		 Session 12: Reliability and characterization
Chair: D. Allen, Cranfield Univ., Bedford, UK
FAILURE OF POLYMERIC INTERFACES UNDER HYGROTHERMAL LOADING
A. Tay, NUS, Singapore		 INFLUENCE OF MATERIALS SELECTION AND QUALITY ON INK JET NOZZLES FABRICATED BY MICRO-ELECTRODISCHARGE MACHINING
H. Almond, D. Allen, Cranfield Univ., Oal, UK
HIGH LEVEL FAULT MODELING IN SURFACE-MICROMACHINED MEMS
N. Deb, R.D. Blanton, Carnegie Mellon Univ., Pittsburgh, USA		 EFFECTS OF DC & AC BIAS ON THE DYNAMIC PERFORMANCE OF MICRO RESONATORS
F.E.H. Tay, R. Kumaran, B.L. Chua, V.J. Logeeswaran, NUS, Singapore
MEMS PHYSICAL ANALYSIS IN ORDER TO COMPLETE EXPERIMENTAL RESULTS RETURN
X. Lafontan1, 2, C. Dufaza1, G. Perez2, F. Pressecq2, 1LIRMM, Montpellier, France, 2CNES, Toulouse, France		 SI-BASED MICROPHONE TESTING METHODOLOGY AND NOISE REDUCTION
C.S. Premachadran, W. Zhe, T.C. Chai, S.C. Chong, M.K. Iyer, Inst. of Microelectronics, Singapore
MEMS IC TEST PROBE UTILIZING FRITTING CONTACTS
T. Itoh1, K. Kataoka1, G. Engelmann2, J. Wolf2, O. Ehrmann2, H. Reichl2, T. Suga1, 1Univ. of Tokyo, Japan, 2FIZM, Berlin, Germany		 NEW TYPES OF SILICON TORSION MICROSPRING AND THEIR CHARACTERISATION
W. Brenner, Gh. Haddad, H. Rennhofer, M. Rennhofer, A. Vujanic, G. Popovic, TU of Vienna, Austria
TEST STRUCTURES FOR CMOS-COMPATIBLE SILICON PRESSURE SENSORS RELIABILITY CHARACTERIZATION
E. Montané, S. Bota, S. Marco, M. Carmona, J. Samitier, Univ. of Barcelona, Spain		 MICROMECHANICAL SILICON PRECISION SCALE
A. Oja1, T. Silanpää1, H. Seppä1, J. Kiihamäki2, P. Seppälä2, J. Karttunen2, K. Riski3, 1VTT Automation, Espoo, Finland, 2VTT Electronics, Espoo, Finland, 3Centre for Metrology and Accreditation, Espoo, Finland