Microfabrication, Integration and Packaging

 

Aim of the Conference

This Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary invited talks.

Conference Chair: K. GABRIEL, Carnegie Mellon University, Pittsburgh, USA

Conference Co-Chair: A. TAY, National University of Singapore

Programme Committee

V. BRIGHT, Univ. of Colorado, Boulder, USA
W. BENECKE, Univ. of Bremen, Germany
H. BOHLMANN, IVAM, Dortmund, Germany
B. MICHEL, IZM, Berlin, Germany
H. FUJITA, Univ. of Tokyo, Japan
J. WALKER, Lucent Technologies, Holmdel, USA
K. SATO, Nagoya Univ., Japan
R. MAEDA, MITI, Tsukuba, Japan
J. SOHN, Draper Lab., Cambridge, USA
A. WILD, Motorola, Phoenix, USA
M. de LABACHELERIE, LPMO, Besançon, France
P. VIKTOROVITCH, LEOM, Ecully, France
F. BAILLIEU, ESIEE, Paris, France
D. ALLEN, Cranfield Univ., Bedford, UK
F. TAY, National Univ. of Singapore
T.C. CHAI, Institute of Microelectronics, Singapore
S. VALETTE, LETI, Grenoble, France
P. McWHORTHER, Sandia Nat. Labs, Albuquerque, USA
D. TOLFREE, DRAL, Warrington, UK
V. KEMPE, AMS, Unterpremstatten, Austria
E. PEETERS, Xerox Parc, Palo Alto, USA
C. ROUMENIN, Bulgarian Acad. Sc., Sofia, Bulgaria

Posters

HIGH-ASPECT-RATIO ELECTROPLATED Ni-Co MICROSTRUCTURES WITH IMPROVED ADHESION USING LIGA-LIKE PROCESS AND NOVALAK SUBLAYER
C.G.K. Malek1, S.S. Das1, L. Thomas2, 1Louisiana State Univ., Baton Rouge, USA, 2DRC, USA

MS RELIABILITY ESTIMATION FEATURES
A. Andonova1, Ch. Roumenin2, 1TU of Sofia, Bulgaria, 2Bulgarian Academy of Sciences, Sofia, Bulgaria

APPLICATION OF A NEW ELECTROMETRIC APPROACH TO STUDY INTERACTION BETWEEN BIOLOGICAL MOLECULES
N.F. Starodub1, I.P. Goraychuk2, V.M. Starodub1, V.V. Ilchenko2, 1Ukrainian National Academy of Sciences, Kiev, The Ukraine, 2Kiev National T. Shevchenko Univ., The Ukraine

SILICON OPTOELECTRONIC INTEGRATED CIRCUITS FOR MOEMS
D. Cristea1, F. Craciunoiu2, 1IMT Bucharest, Romania, 2ECOSEN Ltd., Bucharest, Romania

ARRAY OF NIOBIUM NANOTIPS FORMED IN POROUS ANODIC ALUMINA MATRIX
V. Surganov, G. Gorokh, Belarusian State Univ. of Informatics and Radioelectronics, Minsk, Belarus

A TECHNICAL COMPARISON OF MICRO-ELECTRODISCHARGE MACHINING, MICRODRILLING AND COPPER VAPOUR LASER MACHINING FOR THE FABRICATION OF INK JET NOZZLES
D. Allen, H. Almond, P. Logan, Cranfield Univ., Bedford, UK

SURFACE INVESTIGATION of POROUS GaAs USED FOR LUMINESCENT FILMS
V. Snitka, I. Simkiene, K. Grigoras, V. Jasutis, K. Naudzius, V. Pacebutas, J. Sabataitytë, V. Mizariene, Kaunas Univ. of Technology, Lithuania

MEMS STRUCTURE-MICROMIRROR ARRAY
M. Huja, M. Husak, Czech TU., Praha, Czech Republic

DEEP ANISOTROPIC PLASMA ETCHING OF SILICON SUBSTRATES
P. Ranson, S. Aachboun, C. Hibert, M. Boufnichel, Univ. d’Orléans, France

ANODIC OXIDATION IN ELECTROSTATIC POLYSILICON ACTUATORS
P. Voumard, S. Gonseth, G. Perregaux, P. Debergh, CSEM, Neuchâtel, Switzerland

HIGH 3-D RESOLUTION GRAY-TONE LITHOGRAPHY
N. Dumbravescu, IMT Bucharest, Romania