DTIP 2000 - Final Call

DTIP of MEMS/MOEMS

Final Call For Papers

Chair: Bernard COURTOIS, TIMA, France
Co-Chair: Karina MARKUS, Cronos, USA

Conferences

Invitation to participate

CAD, Design and Test

Chair: S. CRARY, The University of Michigan, USA

Co-Chair: J.M. KARAM, MEMSCAP, France

The industry of micromachining is in its infancy today, just as the VLSI industry has been developing quickly since the late 70's.
As design tools made possible the development of the IC industry, design tools will make possible the development of new components combining the physical world needs of sensing and actuators with the rapidly growing capabilities of information technology.
This Symposium will be a follow-up to the very successfull first issue held last spring in PARIS. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. This year, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems.
We look forward to welcoming you to PARIS and encourage you to participate by submitting an abstract for one of the two Conferences.

B. COURTOIS, TIMA
K. MARKUS, Cronos

Microfabrication, Integration and Packaging

Chair: K. GABRIEL, Carnegie Mellon University, Pittsburgh, USA

Co-Chair: A. TAY, National University of Singapore

Submission of abstracts Deadline: 15 November 1999

DTIP of MEMS/MOEMS Final Call For Papers

CAD, Design and Test Microfabrication, Integration
and Packaging
Conference Chair: S. CRARY, The University of Michigan, USA
Conference Co-Chair: J.M. KARAM, MEMSCAP, France
Conference Chair: K. GABRIEL, Carnegie Mellon University, Pittsburgh, USA
Conference Co-Chair: A. TAY, National University of Singapore

Programme Committee
J. GILBERT, Microcosm Technologies, Cambridge, USA
S. BLANTON, Carnegie Mellon University, Pittsburgh, USA
M. RENCZ, TU Budapest, Hungary
J. WHITE, MIT, Cambridge, USA
B. VIGNA, STMicroelectronics, Cornadero, Italy
F. PRESSECQ, CNES, Toulouse, France
A. CAO, Mentor Graphics, San Jose, USA
R. LAWTON, JPL/Nasa, Pasadena, USA
M.A. MAHER, Memscap Inc., Raleigh, USA
A. PADMANAHHAN, Honeywell Tech. Center, Minneapolis, USA
J. DENATALE, Rockwell Science Centre, Thousand Oaks, USA
D. KOURY, Morotola, Phoenix, USA
D. OSTERGAARD, ANSYS, Canonsburgh, USA
M. MATTERS, Philips, Eindhoven, The Netherlands
H.R. KRAUSS, Robert Bosch, Reutlingen, Germany
S. LEVITAN, Univ. of Pittsburgh, USA
F. MALOBERTI, Univ. of Pavia, Italy
T. SKORDAS, Commission of the European Communities
S. UPPILI, Institute of Microelectronics, Singapore
Y. LIANG, National Univ. of Singapore
F. MASEEH, IntelliSense, Wilmington, USA
A. PRZEKWAS, CFD Research Corp., Huntsville, USA
This Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks (see below).
The topics for this Conference include:

Technology CAD in general
Modeling and simulation of fabrication processes
Devices and components (sensors, actuators, ...)
MEMS/MOEMS libraries and IP
Signal processing
Integrated CAD tools
Numerical simulation
Yield estimation
Failure mechanisms
Fault modeling
Fault simulation and test pattern generation
Thermal evaluation
Interoperability of CAD/CAE tools
Multidomain simulation
Structured design methodologies
Languages for interchange data among designs and tools

Programme Committee
V. BRIGHT, Univ. of Colorado, Boulder, USA
W. BENECKE, Univ. of Bremen, Germany
H. BOHLMANN, IVAM, Dortmund, Germany
B. MICHEL, IZM, Berlin, Germany
H. FUJITA, Univ. of Tokyo, Japan
J. WALKER, Lucent Technologies, Holmdel, USA
K. SATO, Nagoya Univ., Japan
R. MAEDA, MITI, Tsukuba, Japan
J. SOHN, Draper Lab., Cambridge, USA
A. WILD, Motorola, Tempe, USA
M. de LABACHELERIE, LPMO, Besançon, France
P. VIKTOROVITCH, LEOM, Ecully, France
F. BAILLIEU, ESIEE, Paris, France
D. ALLEN, Cranfield Univ., Bedford, UK
F. TAY, National Univ. of Singapore
T.C. CHAI, Institute of Microelectronics, Singapore
S. VALETTE, LETI, Grenoble, France
P. McWHORTHER, Sandia Nat. Labs, Albuquerque, USA
D. TOLFREE, DRAL, Warrington, UK
V. KEMPE, AMS, Unterpremstatten, Austria
E. PEETERS, Xerox Parc, Palo Alto, USA
C. ROUMENIN, Bulgarian Acad. Sc., Sofia, Bulgaria
This Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks (see below).
The topics for this Conference include:

Integrated processes (micromachining, micromolding, ...)
Microlithography issues unique to MEMS/MOEMS
Manufacturing
Materials
Assembly technologies
Packaging for harsh environments
MOEMS packaging
RF and microwave packaging
Test structures
Devices and components (sensors, actuators, ...)
Dimensional measurements
Physical measurements
Failure analysis
Reliability
Characterization
Process monitoring

Plenary invited talks
Very prominent speakers will be invited to give plenary talks.

Workshop on MEMS/MOEMS business development
A Workshop on MEMS/MOEMS business development will be organized in the framework of the Symposium.
The industry of MEMS/MOEMS is developing as a specific industrial area, with its own suppliers of components, with manufacturers of equipment for the fabs, with CAD tool vendors, etc. The goal of the Workshop is to discuss examples of industrial successes of the MEMS/MOEMS industry, to characterize the industrial development of the MEMS/MOEMS business in Europe, USA, Asia.
The Workshop will put together various participants: researchers, industrial actors (components, software, equipment, material, ...), financial investors (venture capital organizations, banks, ...) from Europe, USA and Asia providing a forum of exchanges and cross fertilization in view of business development. The format of the Workshop will consist in short presentations and in a panel. If you want to contribute, please contact the Workshop Chair:
J. BOREL, STMicroelectronics, 850 rue Jean Monnet, 38926 Crolles cedex, France.

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Contacts
B. COURTOIS
TIMA
Tel.: +33 4 76 57 46 15
Fax: +33 4 76 47 38 14 K. MARKUS
Cronos
Tel.: +1 919 380 1316 x111
Fax: +1 919 465 0486
S. CRARY
The University of Michigan
Tel.: +1 734 936 2597
Fax: +1 734 647 1781 J.M. KARAM
MEMSCAP
Tel.: +33 4 76 70 93 70
Fax: +33 4 76 48 93 38
K. GABRIEL
Carnegie Mellon University
Tel.: +1 412 268 4241
Fax: +1 412 268 3890 A. TAY
National University of Singapore
Tel.: +65 874 2207
Fax: +65 777 7936
J. BOREL
STMicroelectronics
Tel.: +33 4 76 92 62 99
Fax: +33 4 76 08 96 52

Exhibition
An exhibition will be organized in the framework of the Symposium. CAD software, products, equipments, instruments, foundries offerings, ...etc, may be exhibited. Exhibitors who will register early enough will be given the opportunity to give a product presentation during the vendor session that will be placed in the Symposium programme. If you plan to exhibit, please contact the Symposium Chair.

Specific Events Sponsoring
If you wish to sponsor an event like a reception, a lunch, or any specific event during the Symposium, please contact the Symposium Chair.

Parisian Evening
A social event is being organized at LIDO de PARIS, the world most famous cabaret. The event will include dinner and dancing and a cabaret show.
Details are available from F. SANTAMARIA.

Location
The Symposium will be held at Le MERIDIEN Montparnasse Hotel. Le MERIDIEN Montparnasse is one of the largest convention centres in Europe. It is located in the famous Montparnasse area, in the southern part of dowtown PARIS, where many famous painters have been living. Today, Montparnasse is a mix of cultural past and state-of-the-art development area.
AIR FRANCE shuttles are available (2 minutes walking distance from the hotel) to/from Roissy Charles de Gaulle (40 minutes) and Orly (20 minutes) airports. Line B of RER (express subway) to Denfert Rochereau for Roissy Charles de Gaulle.

Paper Review
To ensure a high-quality conference, all abstracts will be reviewed by the Programme Committee of the respective conferences.

Oral or Poster Presentation
Submitted papers may be selected for oral or poster presentation. All oral and poster presentations will be included in the Symposium Proceedings.

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Submission of Abstracts
Your abstract must include the following:

the conference you submit to (only one Conference, either CAD, Design and Test, or Microfabrication, Integration and Packaging).

ABSTRACT TITLE

AUTHOR LISTING (principal author first)
First (given) name, Last (family) name, and affiliations, Mailing address, telephone, fax, and e-mail address.

PRESENTATION
Indicate your preference for "Oral Presentation" or "Poster Presentation". Placement is subject to chair's discretion.

ABSTRACT TEXT
Not less than 250 words, preferably 1500 words.

KEY WORDS
List a maximum of five key words.

BRIEF BIOGRAPHY (of principal author)
Approximately 50 words.

Please select only one of the following options to submit your abstract:

mail 7 copies to the Symposium Chair:

Bernard COURTOIS
DTIP 2000
TIMA, 46 avenue Félix Viallet
38031 Grenoble Cedex
France

or e-mail each abstract separately to:

Bernard.Courtois
in ASCII text (not encoded) format. To ensure proper receipt and paper processing, please include the words DTIP 2000 in the subject line

or fax one copy (fax each abstract separately) to:

Bernard COURTOIS
DTIP 2000
+33 4 76 47 38 14

Conditions of Acceptance
Authors are expected to secure registration fees and travel and accommodation funding, through their sponsoring organizations, before submitting abstracts.
Only original material should be submitted.
Abstracts should contain enough detail to clearly convey the approach and the results of the research.
Government and company clearance to present and publish should be final at the time of submittal.
Commercial papers with no research, presenting products, cannot be submitted to the Symposium. Such papers can be presented in the framework of the exhibition (see corresponding section).

Dates

Submission of abstracts: 15 November 1999
Notification of acceptance: 31 December 1999
Manuscript due date: 21 February 2000

Grants
It is expected that grants to help scientists from Eastern and Central Europe will be offered by the Ministry for National Education, Research and Technology. Contact the General Chair for details.

Proceedings
It is expected that the proceedings of the Symposium will be published by SPIE, the International Society for Optical Engineering. Proceedings published by SPIE are abstracted by INSPEC, Compendex, Current Contents, Chemical Abstract Service, Astrophysics Data System, International Aerospace Abstracts, and several others. The Proceedings of the Symposium will be available at the meeting.

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CAD, Design and Test	Microfabrication, Integration and Packaging
Conference Chair: S. CRARY, The University of Michigan, USA Conference Co-Chair: J.M. KARAM, MEMSCAP, France	Conference Chair: K. GABRIEL, Carnegie Mellon University, Pittsburgh, USA Conference Co-Chair: A. TAY, National University of Singapore
Programme Committee J. GILBERT, Microcosm Technologies, Cambridge, USA S. BLANTON, Carnegie Mellon University, Pittsburgh, USA M. RENCZ, TU Budapest, Hungary J. WHITE, MIT, Cambridge, USA B. VIGNA, STMicroelectronics, Cornadero, Italy F. PRESSECQ, CNES, Toulouse, France A. CAO, Mentor Graphics, San Jose, USA R. LAWTON, JPL/Nasa, Pasadena, USA M.A. MAHER, Memscap Inc., Raleigh, USA A. PADMANAHHAN, Honeywell Tech. Center, Minneapolis, USA J. DENATALE, Rockwell Science Centre, Thousand Oaks, USA D. KOURY, Morotola, Phoenix, USA D. OSTERGAARD, ANSYS, Canonsburgh, USA M. MATTERS, Philips, Eindhoven, The Netherlands H.R. KRAUSS, Robert Bosch, Reutlingen, Germany S. LEVITAN, Univ. of Pittsburgh, USA F. MALOBERTI, Univ. of Pavia, Italy T. SKORDAS, Commission of the European Communities S. UPPILI, Institute of Microelectronics, Singapore Y. LIANG, National Univ. of Singapore F. MASEEH, IntelliSense, Wilmington, USA A. PRZEKWAS, CFD Research Corp., Huntsville, USA This Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks (see below). The topics for this Conference include: Technology CAD in general Modeling and simulation of fabrication processes Devices and components (sensors, actuators, ...) MEMS/MOEMS libraries and IP Signal processing Integrated CAD tools Numerical simulation Yield estimation Failure mechanisms Fault modeling Fault simulation and test pattern generation Thermal evaluation Interoperability of CAD/CAE tools Multidomain simulation Structured design methodologies Languages for interchange data among designs and tools	Programme Committee V. BRIGHT, Univ. of Colorado, Boulder, USA W. BENECKE, Univ. of Bremen, Germany H. BOHLMANN, IVAM, Dortmund, Germany B. MICHEL, IZM, Berlin, Germany H. FUJITA, Univ. of Tokyo, Japan J. WALKER, Lucent Technologies, Holmdel, USA K. SATO, Nagoya Univ., Japan R. MAEDA, MITI, Tsukuba, Japan J. SOHN, Draper Lab., Cambridge, USA A. WILD, Motorola, Tempe, USA M. de LABACHELERIE, LPMO, Besançon, France P. VIKTOROVITCH, LEOM, Ecully, France F. BAILLIEU, ESIEE, Paris, France D. ALLEN, Cranfield Univ., Bedford, UK F. TAY, National Univ. of Singapore T.C. CHAI, Institute of Microelectronics, Singapore S. VALETTE, LETI, Grenoble, France P. McWHORTHER, Sandia Nat. Labs, Albuquerque, USA D. TOLFREE, DRAL, Warrington, UK V. KEMPE, AMS, Unterpremstatten, Austria E. PEETERS, Xerox Parc, Palo Alto, USA C. ROUMENIN, Bulgarian Acad. Sc., Sofia, Bulgaria This Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks (see below). The topics for this Conference include: Integrated processes (micromachining, micromolding, ...) Microlithography issues unique to MEMS/MOEMS Manufacturing Materials Assembly technologies Packaging for harsh environments MOEMS packaging RF and microwave packaging Test structures Devices and components (sensors, actuators, ...) Dimensional measurements Physical measurements Failure analysis Reliability Characterization Process monitoring
Plenary invited talks Very prominent speakers will be invited to give plenary talks.
Workshop on MEMS/MOEMS business development A Workshop on MEMS/MOEMS business development will be organized in the framework of the Symposium. The industry of MEMS/MOEMS is developing as a specific industrial area, with its own suppliers of components, with manufacturers of equipment for the fabs, with CAD tool vendors, etc. The goal of the Workshop is to discuss examples of industrial successes of the MEMS/MOEMS industry, to characterize the industrial development of the MEMS/MOEMS business in Europe, USA, Asia. The Workshop will put together various participants: researchers, industrial actors (components, software, equipment, material, ...), financial investors (venture capital organizations, banks, ...) from Europe, USA and Asia providing a forum of exchanges and cross fertilization in view of business development. The format of the Workshop will consist in short presentations and in a panel. If you want to contribute, please contact the Workshop Chair: J. BOREL, STMicroelectronics, 850 rue Jean Monnet, 38926 Crolles cedex, France.

Contacts
B. COURTOIS TIMA Tel.: +33 4 76 57 46 15 Fax: +33 4 76 47 38 14	K. MARKUS Cronos Tel.: +1 919 380 1316 x111 Fax: +1 919 465 0486
S. CRARY The University of Michigan Tel.: +1 734 936 2597 Fax: +1 734 647 1781	J.M. KARAM MEMSCAP Tel.: +33 4 76 70 93 70 Fax: +33 4 76 48 93 38
K. GABRIEL Carnegie Mellon University Tel.: +1 412 268 4241 Fax: +1 412 268 3890	A. TAY National University of Singapore Tel.: +65 874 2207 Fax: +65 777 7936
J. BOREL STMicroelectronics Tel.: +33 4 76 92 62 99 Fax: +33 4 76 08 96 52
Exhibition An exhibition will be organized in the framework of the Symposium. CAD software, products, equipments, instruments, foundries offerings, ...etc, may be exhibited. Exhibitors who will register early enough will be given the opportunity to give a product presentation during the vendor session that will be placed in the Symposium programme. If you plan to exhibit, please contact the Symposium Chair.
Specific Events Sponsoring If you wish to sponsor an event like a reception, a lunch, or any specific event during the Symposium, please contact the Symposium Chair.
	Parisian Evening A social event is being organized at LIDO de PARIS, the world most famous cabaret. The event will include dinner and dancing and a cabaret show. Details are available from F. SANTAMARIA.
Location The Symposium will be held at Le MERIDIEN Montparnasse Hotel. Le MERIDIEN Montparnasse is one of the largest convention centres in Europe. It is located in the famous Montparnasse area, in the southern part of dowtown PARIS, where many famous painters have been living. Today, Montparnasse is a mix of cultural past and state-of-the-art development area. AIR FRANCE shuttles are available (2 minutes walking distance from the hotel) to/from Roissy Charles de Gaulle (40 minutes) and Orly (20 minutes) airports. Line B of RER (express subway) to Denfert Rochereau for Roissy Charles de Gaulle.

Paper Review To ensure a high-quality conference, all abstracts will be reviewed by the Programme Committee of the respective conferences.
Oral or Poster Presentation Submitted papers may be selected for oral or poster presentation. All oral and poster presentations will be included in the Symposium Proceedings.

Submission of Abstracts Your abstract must include the following: the conference you submit to (only one Conference, either CAD, Design and Test, or Microfabrication, Integration and Packaging). ABSTRACT TITLE AUTHOR LISTING (principal author first) First (given) name, Last (family) name, and affiliations, Mailing address, telephone, fax, and e-mail address. PRESENTATION Indicate your preference for "Oral Presentation" or "Poster Presentation". Placement is subject to chair's discretion. ABSTRACT TEXT Not less than 250 words, preferably 1500 words. KEY WORDS List a maximum of five key words. BRIEF BIOGRAPHY (of principal author) Approximately 50 words. Please select only one* of the following options to submit your abstract:* mail 7 copies to the Symposium Chair: Bernard COURTOIS DTIP 2000 TIMA, 46 avenue Félix Viallet 38031 Grenoble Cedex France or e-mail each abstract separately to: Bernard.Courtois in ASCII text (not encoded) format. To ensure proper receipt and paper processing, please include the words DTIP 2000 in the subject line or fax one copy (fax each abstract separately) to: Bernard COURTOIS DTIP 2000 +33 4 76 47 38 14
Conditions of Acceptance Authors are expected to secure registration fees and travel and accommodation funding, through their sponsoring organizations, before submitting abstracts. Only original material should be submitted. Abstracts should contain enough detail to clearly convey the approach and the results of the research. Government and company clearance to present and publish should be final at the time of submittal. Commercial papers with no research, presenting products, cannot be submitted to the Symposium. Such papers can be presented in the framework of the exhibition (see corresponding section).
Dates Submission of abstracts: 15 November 1999 Notification of acceptance: 31 December 1999 Manuscript due date: 21 February 2000
Grants It is expected that grants to help scientists from Eastern and Central Europe will be offered by the Ministry for National Education, Research and Technology. Contact the General Chair for details.
Proceedings It is expected that the proceedings of the Symposium will be published by SPIE, the International Society for Optical Engineering. Proceedings published by SPIE are abstracted by INSPEC, Compendex, Current Contents, Chemical Abstract Service, Astrophysics Data System, International Aerospace Abstracts, and several others. The Proceedings of the Symposium will be available at the meeting.