CAD, Design and Test Conference

 

Aim of the Conference

This Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary invited talks.

Conference Chair: S. CRARY, The University of Michigan, USA

Conference Co-Chair: J.M. KARAM, MEMSCAP, France

Programme Committee

J. GILBERT, Microcosm Technologies, Cambridge, USA
S. BLANTON, Carnegie Mellon Univ., Pittsburgh, USA
M. RENCZ, TU Budapest, Hungary
J. WHITE, MIT, Cambridge, USA
B. VIGNA, STMicroelectronics, Cornadero, Italy
F. PRESSECQ, CNES, Toulouse, France
A. CAO, Mentor Graphics, San Jose, USA
R. LAWTON, JPL/Nasa, Pasadena, USA
M.-A. MAHER, MEMScAP Inc., Raleigh, USA
A. PADMANAHHAN, Honeywell Tech. Center, Minneapolis, USA
J. DENATALE, Rockwell Science Centre, Thousand Oaks, USA
D. KOURY, Morotola, Phoenix, USA
D. OSTERGAARD, ANSYS, Canonsburgh, USA
M. MATTERS, Philips, Eindhoven, The Netherlands
H.R. KRAUß, Robert Bosch, Reutlingen, Germany
S. LEVITAN, Univ. of Pittsburgh, USA
F. MALOBERTI, Univ. of Pavia, Italy
T. SKORDAS, Commission of the European Communities
S. UPPILI, Institute of Microelectronics, Singapore
Y. LIANG, National Univ. of Singapore
F. MASEEH, IntelliSense, Wilmington, USA
A. PRZEKWAS, CFD Research Corp., Huntsville, USA

Posters

INTERNATIONAL FREQUENCY SENSOR ASSOCIATION (IFSA): GOALS AND ACTIVITIES
S.Y. Yurish, Inst. of Computer Technologies, Lviv, The Ukraine

MODELLING OF 3D PIEZORESISTIVE ACCELEROMETER WITH INERTIAL MASS
I. Pavelescu, V. Moagar-Poladian, IMT, Bucharest, Romania

SIMULATION OF REFRACT-DIFFRACT MICRO-OPTICS ELEMENT WITH GRAY-TONE CODING METHOD
J. Yao, F. Gao, J. Su, Y. Guo, Sichuan Univ., China

ANALYSIS OF ELECTROMECHANICAL PARAMETERS OF ELECTROSTATIC MICRORELAY WITH A MOVABLE ELASTIC CANTILEVER ELECTRODE
G.I. Efremov, N.I. Mukhurov, A.V. Galdetskiy, Belarus National Academy of Sciences, Minsk, Belarus

DYNAMIC CHECKING IMPROVES MEMS DESIGN METHODOLOGY
X. Marin1, J. Bausells1, J. Carrabina2, 1CNM, Bellaterra, Spain, 2Univ. Autonoma de Barcelona, Spain

AN EMBEDDED FILAMENT CONCEPT FOR MODELING MIXED SIGNAL INTEGRATED CIRCUITS IN 3D ENVIRONMENTS
M.Z. Pindera, S. Bayyuk, V. Upadhya, M. Athavale, A. Przekwas, CFD Research, Huntsville, USA

NEW METHODOLOGY OF WORK WITH CONCURRENT ENGINEERING IN ELECTRONIC DESIGN
P. Owezarski, V. Baudin, S. Owezarski, G. Fabre, T. Gayraud, J.-M. Dorkel, P. Tounsi, LAAS, Toulouse, France

MODELING AND DESIGN OF MULTI-BURIED JUNCTION DETECTORS FOR COLOR SYSTEMS DEVELOPMENT
A. Alexandre1, G. Sou1, M. Ben Chouikha1, M. Sedjil1, G.N. Lu2, G. Alquie1, 1Univ. Pierre et Marie Curie, Paris, France, 2Univ. Lyon 1, Villeurbanne, France

EVALUATION OF THE ORIENTATION OF THERMAL DEFORMATION IN THE SURFACE MICROMACHINED MEMBRANE OF THE GAS MICROSENSORS
M. Dumitrescu1, C. Cobianu1, A. Pascu2, 1IMT, Bucharest, Romania, 2Univ. Polytechnic of Bucharest, Romania

NEXUS SURVEY AND USER-SUPPLIER CLUB ON CAD
P. Salomon, MEMScAP GmbH, Germany