CAD, Design and Test Conference

Aim of the Conference This Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary invited talks. Conference Chair: S. CRARY, The University of Michigan, USA Conference Co-Chair: J.M. KARAM, MEMSCAP, France

Programme Committee J. GILBERT, Microcosm Technologies, Cambridge, USA S. BLANTON, Carnegie Mellon Univ., Pittsburgh, USA M. RENCZ, TU Budapest, Hungary J. WHITE, MIT, Cambridge, USA B. VIGNA, STMicroelectronics, Cornadero, Italy F. PRESSECQ, CNES, Toulouse, France A. CAO, Mentor Graphics, San Jose, USA R. LAWTON, JPL/Nasa, Pasadena, USA M.-A. MAHER, MEMScAP Inc., Raleigh, USA A. PADMANAHHAN, Honeywell Tech. Center, Minneapolis, USA J. DENATALE, Rockwell Science Centre, Thousand Oaks, USA D. KOURY, Morotola, Phoenix, USA D. OSTERGAARD, ANSYS, Canonsburgh, USA M. MATTERS, Philips, Eindhoven, The Netherlands H.R. KRAUß, Robert Bosch, Reutlingen, Germany S. LEVITAN, Univ. of Pittsburgh, USA F. MALOBERTI, Univ. of Pavia, Italy T. SKORDAS, Commission of the European Communities S. UPPILI, Institute of Microelectronics, Singapore Y. LIANG, National Univ. of Singapore F. MASEEH, IntelliSense, Wilmington, USA A. PRZEKWAS, CFD Research Corp., Huntsville, USA

Posters INTERNATIONAL FREQUENCY SENSOR ASSOCIATION (IFSA): GOALS AND ACTIVITIES S.Y. Yurish, Inst. of Computer Technologies, Lviv, The Ukraine MODELLING OF 3D PIEZORESISTIVE ACCELEROMETER WITH INERTIAL MASS I. Pavelescu, V. Moagar-Poladian, IMT, Bucharest, Romania SIMULATION OF REFRACT-DIFFRACT MICRO-OPTICS ELEMENT WITH GRAY-TONE CODING METHOD J. Yao, F. Gao, J. Su, Y. Guo, Sichuan Univ., China ANALYSIS OF ELECTROMECHANICAL PARAMETERS OF ELECTROSTATIC MICRORELAY WITH A MOVABLE ELASTIC CANTILEVER ELECTRODE G.I. Efremov, N.I. Mukhurov, A.V. Galdetskiy, Belarus National Academy of Sciences, Minsk, Belarus DYNAMIC CHECKING IMPROVES MEMS DESIGN METHODOLOGY X. Marin1, J. Bausells1, J. Carrabina2, 1CNM, Bellaterra, Spain, 2Univ. Autonoma de Barcelona, Spain AN EMBEDDED FILAMENT CONCEPT FOR MODELING MIXED SIGNAL INTEGRATED CIRCUITS IN 3D ENVIRONMENTS M.Z. Pindera, S. Bayyuk, V. Upadhya, M. Athavale, A. Przekwas, CFD Research, Huntsville, USA NEW METHODOLOGY OF WORK WITH CONCURRENT ENGINEERING IN ELECTRONIC DESIGN P. Owezarski, V. Baudin, S. Owezarski, G. Fabre, T. Gayraud, J.-M. Dorkel, P. Tounsi, LAAS, Toulouse, France MODELING AND DESIGN OF MULTI-BURIED JUNCTION DETECTORS FOR COLOR SYSTEMS DEVELOPMENT A. Alexandre1, G. Sou1, M. Ben Chouikha1, M. Sedjil1, G.N. Lu2, G. Alquie1, 1Univ. Pierre et Marie Curie, Paris, France, 2Univ. Lyon 1, Villeurbanne, France EVALUATION OF THE ORIENTATION OF THERMAL DEFORMATION IN THE SURFACE MICROMACHINED MEMBRANE OF THE GAS MICROSENSORS M. Dumitrescu1, C. Cobianu1, A. Pascu2, 1IMT, Bucharest, Romania, 2Univ. Polytechnic of Bucharest, Romania NEXUS SURVEY AND USER-SUPPLIER CLUB ON CAD P. Salomon, MEMScAP GmbH, Germany