Aim of the Symposium


The industry of micromachining is in its infancy today, just as the VLSI industry has been developing quickly since the late 70's.

As design tools made possible the development of the IC industry, design tools will make possible the development of new components combining the physical world needs of sensing and actuators with the rapidly growing capabilities of information technology.

This Symposium will be a follow-up to the very successful first issue held last spring in PARIS. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. This year, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices and systems.

The Symposium is sponsored by the IEEE Computer Society Test Technology Technical Council and TIMA Laboratory, in cooperation with the IEEE Components, Packaging and Manufacturing Technology Society, SPIE The International Society for Optical Engineering and the IEEE Circuits and Systems Society in collaboration with the French Chapter.

We look forward to welcoming you in PARIS.


K. MARKUS, Cronos